Industry Directory: die move (2)

Spectrum Integrity, Inc.

Industry Directory | Consultant / Service Provider / Manufacturer

Spectrum Integrity is a full service Engineering Design Service Firm. We are a Solution Provider for companies requiring outstanding hardware designs for advanced RF, High-Speed, and Semiconductor Test applications.

Argo EMS, a Division of The Eastern Company

Industry Directory | Manufacturer

Argo is an AS9100D, ISO 9001:2015 registered CM of PCB Assemblies. We accommodate prototypes, quick turn and production quantities of kitted or turnkey assemblies.

New SMT Equipment: die move (3)

N200 - Depaneling Punch for Round Tab Routed Boards

N200 - Depaneling Punch for Round Tab Routed Boards

New Equipment | Depaneling

Low Cost Punch For Singulation Small Tab Routed Panels N200 singulates one tab at a time with upper and lower pinch blades. Singulate curve routed and odd shaped boards. Top and bottom knife set cuts tabs cleanly. Minimal stress on PCB. Toolin

FKN Systek

Xynetics/Electroglas 1034X Die Prober Test Station

Xynetics/Electroglas 1034X Die Prober Test Station

New Equipment | Test Equipment

Xynetics 1034X Die Prober Test Station with Olympus Microscope head. The eye pieces are Olympus G20x 12.2. We are unable to test this prober. Cables for the controller to connect to the probe station are not available. Contact for freight shipping de

SurplusEQ

Electronics Forum: die move (22)

Die placement with MPA-G3 pick and place

Electronics Forum | Thu Jun 06 08:16:13 EDT 2002 | caldon

Jim- Sorry I can not offer advice on the Panasonic machine but do want to shed light on the Die and waffle pack issue. Take note that if the Die are loose in the pockets the balls or terminations could be damaged. The thin layer that the ball is atta

Die attach with solder paste

Electronics Forum | Wed Aug 28 10:16:12 EDT 2002 | Jim M.

Sam We install a lot of die in the SMT room using same process as SMT parts.Water soluble solder paste is used for attachment of die to ceramic and boards. Biggest problem i found is the adjustment from installing the die in the bonding area. The t

Industry News: die move (44)

Henkel Names New Global Sales Director for Semiconductor Materials

Industry News | 2009-02-02 18:48:47.0

Henkel today announced the appointment of Mr. Luc Godefroid as the company's Global Sales Director for its Semiconductor Group. A key member of Henkel's electronics sales team since 2001, Godefroid's new role sees him building on his previous success and directing the global sales efforts of Henkel's worldwide team and expanded product portfolio.

Heller Industries Inc.

Most Versatile Actuator to Date

Industry News | 2003-04-17 08:15:33.0

In launching the LA35 series, SMAC reckons it has produced an actuator with unrivalled versatility.

SMTnet

Parts & Supplies: die move (35)

Panasonic 104131003802 Bending die AI Pa

Panasonic 104131003802 Bending die AI Pa

Parts & Supplies | SMT Equipment

Large supply of AI / SMT Panasonic, Universal accessories. Panasonic AVK AVKII JVK JVKII AV AVB AJ JV RH3 RH6 AI parts X01A13034G1 LEAD CUTTER(A) X01A13035G1 LEAD CUTTER(A) X01A1303602 LEAD LINE GUIDE(A) X01A1303702 LEAD LINE GUIDE(

Jinchen Electric Technology Co,.Ltd

Panasonic 104131003902 Bending die AVK P

Panasonic 104131003902 Bending die AVK P

Parts & Supplies | SMT Equipment

104131003902 Bending die AVK Parts Panasonic Smt AI Parts Panasonic AI-SMT parts list: PANASONIC-AI MACHINES SPARE PARTS LIST 1015652016 Lever - 'Common' MPA  1015652302 Chuck - ' ' {Small} MPA  1015652303 Chuck - 'Y' {Small} MPA 

Jinchen Electric Technology Co,.Ltd

Technical Library: die move (1)

Challenges in Bare Die Mounting

Technical Library | 2014-05-08 16:34:16.0

Bare die mounting on multi-device substrates has been in use in the microelectronics industry since the 1960s. The aerospace industry’s hybrid modules and IBM’s Solid Logic Technology were early implementations that were developed in the 1960’s. The technologies progressed on a steady level until the mid 1990’s when, with the advent of BGA packaging and chip scale packages, the microelectronics industry started a wholesale move to area array packaging. This paper outlines the challenges for both traditional wire-bond die attached to a printed wiring board (pwb), to the more recent applications of bumped die attached to a high performance substrate.

Die Products Consortium

Videos: die move (24)

Aull Automatic Inline V-Cut PCB Depaneler

Aull Automatic Inline V-Cut PCB Depaneler

Videos

Full Automatic V-cut PCB Depaneler Introduction: This equipment can further improve the quality of depaneling. It can realize V-groove XY two-way automatic cutting, cutting aluminum & FR4 boards without burr, can connect the assembly line to realize

Winsmart Electronic Co.,Ltd

N200 Video0109

N200 Video0109

Videos

Low Cost Punch For Singulation Small Tab Routed Panels N200 singulates one tab at a time with upper and lower pinch blades. Singulate curve routed and odd shaped boards. Top and bottom knife set cuts tabs cleanly. Minimal stress on PCB. Toolin

FKN Systek

Career Center - Jobs: die move (1)

Electronic Packaging Engineer

Career Center | Melbourne, Florida USA | Engineering,Research and Development

Harris Corporation (NYSE-HRS) is an international communications equipment company focused on providing product, system, and service solutions that take its customers to the next level. The company provides wireless, broadcast, government, and networ

Harris Corporation

Career Center - Resumes: die move (1)

Carl's Resume

Career Center | La Crosse, Wisconsin USA | Maintenance,Production,Quality Control,Technical Support

Ability to read,comprehend and troubleshoot ele- ctronic components using blue prints or schema- tics.

Express Newsletter: die move (211)

SMTnet Express - May 8, 2014

SMTnet Express, May 8, 2014, Subscribers: 22716, Members: Companies: 13872, Users: 36158 Challenges in Bare Die Mounting Larry Gilg, Die Products Consortium Bare die mounting on multi-device substrates has been in use in the microelectronics

Partner Websites: die move (126)

Dek Next Move ES Board Part No. 185253 ID_000448 (7/22): World Equipment Source

| https://www.wesource.com/computer-parts/dek-next-move-es-board-part-no.-185253-id-000448-7/22/

Dek Next Move ES Board Part No. 185253 ID_000448 (7/22): World Equipment Source COMPANY PROFILE FINDER'S PROGRAM R1-Surplus Wesource159   CALL US

Autonom Fahren – ein Modus der zukünftigen Mobilität

| https://productronica.com/de/messe/presse/pressemitteilungen/detail/autonom-fahren-ein-modus-der-zukuenftigen-mobilitaet.html

. Welche Chancen sich durch die weitere Computerisierung des Automobils für die Elektrofertigungsindustrie ergeben, zeigt vom 16. bis 19. November die productronica 2021 in


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