Industry Directory: die surface crack (27)

Surface Mount Technology Association (SMTA)

Surface Mount Technology Association (SMTA)

Industry Directory | Training Provider / Events Organizer / Association / Non-Profit

The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations.

Sonoscan, Inc.

Industry Directory | Consultant / Service Provider / Manufacturer

Designer & Manufacturer of Acoustic Microscopes for Nondestructive Component Inspection.

New SMT Equipment: die surface crack (30)

850G Die Placement AOI

850G Die Placement AOI

New Equipment | Inspection

Microelectronics and Semiconductor Inspection. MVP's 850G provides the highest accuracy flip-chip, die assembly inspection. Ensuring the correct placement of the die on the substrate, while providing edge, FM and surface inspection. The 850G modu

Machine Vision Products, Inc

Clicker Dies

Clicker Dies

New Equipment |  

Our edge-hardened, pre-sharpened knife steel, which we refer to it as �Presharp,� is a high technology, lead-hardened steel that has revolutionized the die-making process. One of Austria�s oldest and most respected steel mills developed a unique proc

Global Die

Electronics Forum: die surface crack (156)

Soldering die to heatsinks

Electronics Forum | Thu Apr 16 08:07:05 EDT 1998 | Stan

Currently I am in the buisness of soldering bare die to the top surface of a copper heat sink. Is any one else have some exprience in this process that can help. We heat a copper slug through a contolled atmosphere, place a preform then a bare die.

pbga substrate crack vision system

Electronics Forum | Thu Sep 24 18:57:03 EDT 2009 | davef

From "siliconfareast.com": Basic Die Cracking FA Flow 1) Failure Information/Device and Lot History Review. Understand the customer's description of the failure, i.e., the failure mode, where it was encountered, what conditions the sample was subject

Used SMT Equipment: die surface crack (2)

ASM Siemens MS899

ASM Siemens MS899

Used SMT Equipment | General Purpose Equipment

ASM MS899-DL Wafer Mapping Die Sorter Machine is in like new condition! Serial Number: MS899DL-01817-0402 Model Number: MS899-DL Year 2008 August Cycle Time: 175 ms XY Placement: +/- 1.5 mil Die Rotation: +/- 3 degrees Collect type: Surfa

1st Place Machinery Inc.

Heller 1800EXL

Heller 1800EXL

Used SMT Equipment | Soldering - Reflow

Features 1. Full hot air reflow heat fast, high thermal efficiency compensation, delta t less than ± 2 ℃ soldering is uniform. 2. HELLER company has 40 years of history, process maturity. 3. maintenance costs low, the furnace normal use, electrici

Dongguan Widen Industrial Co., Ltd

Industry News: die surface crack (314)

GPD Global's PCD Dispensing on Its MAX Series Platform Recognized with Two 2011 Global Technology Awards

Industry News | 2011-11-20 13:36:13.0

GPD Global has been awarded two Global Technology Awards in the categories of Adhesives/Coatings/Encapsulants and Dispensing Equipment for its PCD Dispensing on the MAX Series Platform

GPD Global

GPD Global's PCD Dispensing on Its MAX Series Platform Wins Another Industry Award

Industry News | 2012-03-05 14:26:45.0

GPD Global has been awarded a 2012 NPI Award in the category of Dispensing Equipment for its PCD Dispensing on the MAX Series Platform.

GPD Global

Parts & Supplies: die surface crack (3)

Panasonic Panasonic Engine Accessory AI / Silicone Rubber Hose For Combustion Engines

Panasonic Panasonic Engine Accessory AI / Silicone Rubber Hose For Combustion Engines

Parts & Supplies | Board Cleaners

engine accessory ai rubber hose silicone rubber hose combusition engines Specifications high quality custom cnc machining aluminum metal part products Item high quality custom cnc machining aluminum metal part products Material Stainless Steel

KingFei SMT Tech

Panasonic AV131 N210028286AA BENDING DIE

Panasonic AV131 N210028286AA BENDING DIE

Parts & Supplies | SMT Equipment

Panasonic AI Parts AV131 N210028286AA BENDING DIE Our company is professional Supplier & Manufacturer of SMT(Surface Mount Technology) Spare Parts ,if you have any needs,please contact us in these ways: ZK Electronic Technology Co., Limited

ZK Electronic Technology Co., Limited

Technical Library: die surface crack (15)

Optimizing Reflowed Solder TIM (sTIMs) Processes for Emerging Heterogeneous Integrated Packages

Technical Library | 2023-01-17 17:12:33.0

Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.

Heller Industries Inc.

Conductive Adhesive Dispensing, Process Considerations

Technical Library | 1999-08-27 09:24:56.0

Dispensing conductive adhesives in an automated factory environment creates some special challenges. A robust production process starts with understanding the adhesives in their fluid state and which important parameters must be controlled. Developing this understanding requires experience with a large number of materials and valves over time. Common uses of conductive adhesives in surface mount applications, die attach applications, and gasketing are addressed. As vendors of dispensing equipment, the authors see a constant stream of such applications. Dispensing requirements, techniques, and equipment resulting from this experience are discussed. Guidelines for optimizing quality and speed are given.

ASYMTEK Products | Nordson Electronics Solutions

Videos: die surface crack (96)

FPC / PCB Punching Machine with Die Tooling

FPC / PCB Punching Machine with Die Tooling

Videos

FPC / PCB Punching Dies PCB Depaneler For High Volume Boards Singulation Advantages: 1. Pneumatic, environmental protection 2. High efficiency, suitable for high volume PCBs 3. Security door protection, ensure safe production Features: 1. D

Winsmart Electronic Co.,Ltd

PCB Punch Machine

PCB Punch Machine

Videos

Flexible PCB Board Cutting Machine PCB Punching Machine With Cutomized Die Tooling PCB Punching Machine Features: 1. Depaneling PCB/FPC by means of punching dies, to avoid micro-cracks caused by manual. 2. Die toolings is changeable 3. Easy set

Winsmart Electronic Co.,Ltd

Training Courses: die surface crack (9)

IPC-6012 Specialist (CIS) Certification Training Course

Training Courses | | | IPC-6012 Specialist (CIS)

The Certified IPC-6012 Specialist (CIS) training covers design, fabrication and inspection of rigid printed boards.

Blackfox Training Institute, LLC

Virtual Course: PCB Design for Implementing 3D and High Density Semiconductor Package Technologies

Training Courses | | | PCB Design Courses

The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.

Surface Mount Technology Association (SMTA)

Events Calendar: die surface crack (2)

BGA & Area Array Failures, Causes & Corrective Actions Online Webinar

Events Calendar | Mon Mar 16 00:00:00 EDT 2020 - Mon Mar 16 00:00:00 EDT 2020 | ,

BGA & Area Array Failures, Causes & Corrective Actions Online Webinar

Surface Mount Technology Association (SMTA)

SMTA China East Conference 2018

Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China

SMTA China East Conference 2018

Surface Mount Technology Association (SMTA)

Career Center - Jobs: die surface crack (5)

Assembly Engineer - Electronics

Career Center | , South Carolina | Engineering

Assembly engineer with leadership capabilities needed for this position. Implement the proper controls to assure a reliable operation of the strap/inlay assembly, strap attach, and slitting processes. Actively pursue opportunities to continually imp

Connecti*Pro

Mechanical Engineer

Career Center | Melbourne, Florida USA | Engineering,Production

Mechanical Engineer Candidate will work in the Advanced Manufacturing Technology organization executing the development, qualification, and implementation of leading-edge manufacturing processes across a broad range of applications and support manufa

Harris

Career Center - Resumes: die surface crack (14)

Michael Cooper (BSEE)

Career Center | Fayetteville, Arkansas USA | Engineering,Production

I enjoyed working in Electronics Manufacturing while in college (BSEE) and would like to pursue an engineering job in a related field.

Maurice Fleetwood

Career Center | Torrington, Connecticut | Engineering,Management,Production,Quality Control,Sales/Marketing,Technical Support

MECHANICAL AND ELECTRONIC CAD TECHNOLOGY-CERTIFICATION • TECHNICAL DRAFTING: Equipment Use, Orthographic Projection, Dimensioning, Auxiliary Views, Fasteners, Manufacturing Processes and Fits and Tolerances • POWER TRANSMISSION/ANSI 14.5 1994: Bearin

Express Newsletter: die surface crack (948)

Partner Websites: die surface crack (1251)

Underfill Fluid Dispense on 6 mm Die

GPD Global | https://www.gpd-global.com/co_website/pcdpumpseries-underfill-small.php

Underfill Fluid Dispense on 6 mm Die   Home   Products Fluid Dispense Systems High Precision Dispenser - MAX Series Large Format Board Processing - DS Series Table Top Manufacturing Loader

GPD Global

ASM MS899 Wafer Mapping Die Sorter MS899-DL

1st Place Machinery Inc. | http://www.firstplacemachinery.com/firstplace_asm_MS899.html

: MS899-DL Year 2008 August Cycle Time: 175 ms XY Placement: +/- 1.5 mil Die Rotation: +/- 3 degrees Collect type: Surface pick type Pick/Bond Force: 40 - 250 g (adjustable

1st Place Machinery Inc.


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Surface Mount Technology Association (SMTA)
Surface Mount Technology Association (SMTA)

The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations.

Training Provider / Events Organizer / Association / Non-Profit

6600 City W Pkwy
Eden Prairie, MN USA

Phone: 952-920-7682