> ◇Windows XP operation software with Chinese and English alternative.Whole system under integration control can analyze and display the failure.All production data can be saved completely and analyzed. ◇PC&Siemens PLC controlling unit with stable
> ◇Windows XP operation software with Chinese and English alternative.Whole system under integration control can analyze and display the failure.All production data can be saved completely and analyzed. ◇PC&Siemens PLC controlling unit with stable
Electronics Forum | Thu Nov 18 10:56:16 EST 1999 | Dave F
Jacky: There�re major four factors that affect the reliability of a solder connection. 1 Design of the connection including the shape and height of the lead and the type and amount of solder. 2 Dissolution of base metals into the solder connection.
Electronics Forum | Thu Jan 13 09:18:28 EST 2005 | davef
We agree that coating BGA solder balls with conformal coat is a bad idea due to differences between the z-dimension thermal expansion between the conformal coat and solder.
Used SMT Equipment | Soldering Equipment/Fluxes
Features: Windows XP operation software with Chinese and English alternative available. whole system under integration control can analyze and display the failure. All production data can be saved completely and analyzed. PC& Siemens PLC cont
Used SMT Equipment | Soldering - Reflow
lead-free reflow oven with Nitrogen protecting system,internal or external water-cooling system. main feature: Windows XP operation software with Chinese and English alternative available. whole system under integration control can analyze and displa
Industry News | 2019-04-24 19:28:02.0
MIRTEC, a ‘Leading Global Supplier’ of automated inspection systems to the electronics manufacturing industry, is pleased to announce that East/West Manufacturing Enterprises, a Texas-based Electronic Contract Manufacturer, has purchased an MV-6 OMNI 3D AOI System.
Industry News | 2003-04-25 08:11:22.0
Diluted earnings per share for the quarter were $0.36 compared to the $0.24 earned in last year�s first quarter.
Parts & Supplies | SPI / Solder Paste Inspection
Quick programming, friendly programming interface Multiple measurement methods True one-button measurement Eight-way motion button, one-click focus Adjustable scanning pitch Solder paste 3D simulation function Powerful SPC function MARK
Technical Library | 2016-02-04 19:11:47.0
In a typical mechatronic manufacturing functional test setup, actual load simulations are usually done by connecting the DUT outputs to power or ground in order to establish either a high or low side driver. Each output is connected with different load and the test will either be sequential or concurrent. At lower power levels, these can usually be managed with general purpose switches. However, when it comes to higher power levels of currents more than 5 amps, such switching and loading might pose a greater challenge. Furthermore, critically in the manufacturing line, the tradeoff between cost and test time would have a great influence on the test strategy.This paper will present some key points to design a cost effective high power switching and load management solution.
Technical Library | 2017-03-02 18:13:05.0
The need for more energy-efficient solid-state switches beyond complementary metal-oxide-semiconductor (CMOS) transistors has become a major concern as the power consumption of electronic integrated circuits (ICs) steadily increases with technology scaling. Nano-Electro-Mechanical (NEM) relays control current flow by nanometer-scale motion to make or break physical contact between electrodes, and offer advantages over transistors for low-power digital logic applications: virtually zero leakage current for negligible static power consumption; the ability to operate with very small voltage signals for low dynamic power consumption; and robustness against harsh environments such as extreme temperatures. Therefore, NEM logic switches (relays) have been investigated by several research groups during the past decade. Circuit simulations calibrated to experimental data indicate that scaled relay technology can overcome the energy-efficiency limit of CMOS technology. This paper reviews recent progress toward this goal, providing an overview of the different relay designs and experimental results achieved by various research groups, as well as of relay-based IC design principles. Remaining challenges for realizing the promise of nano-mechanical computing, and ongoing efforts to address these, are discussed.
Training Courses | | | ESD Control Training Courses
Browse training and certification programs for electrostatic discharge (ESD) control in electronics assembly.
Career Center | , | Maintenance,Management,Quality Control,Technical Support
Software: Over 14 years experience in operating and maintaining of different types of Telecommunication and IT equipments � Proven proficiency in operating and maintaining of TDM telecommunication equipment - digital exchanges AXE10 (Ericsson) � Pr
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Quality conscience, detail oriented, manufacturing engineer, with a hands on approach to overall process improvement and development. Motivated with excellent communication skills and a dedicated team player. Qualifications include: � Safety /Diver
SMTnet Express, February 4, 2016, Subscribers: 24,087, Members: Companies: 14,964, Users: 39,872 Make the Right Design Choices in Load Switching and Simulation in a High Current and Mechatronic Functional Test Derek Ong, Lok Teng Kee, Chuah Rhun
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/high-strain-rate?con=t&page=4
. Force has a tendency to increase with strain rate, so border line failures may not be identified. 2. The amount of energy that a solder ball can absorb decreases with the presence of voids and the percentage difference in energy between failure modes is considerably more apparent than force
| https://www.eptac.com/wp-content/uploads/2016/04/eptac_04_20_16.pdf
