Electronics Forum | Wed Nov 17 11:20:23 EST 1999 | Dave F
Hey Gyver: If you don�t mind (which you don�t have any choice about, because I�m going to do it anyhow, cause it�s MY word processor), I�m going to respond genericly, but still be directed to your question. Much of the following is paraphrased from
Electronics Forum | Mon Apr 17 19:46:39 EDT 2000 | Dave F
Murad: Your customer is smart to be concerned about the affect of changing production processes on product reliability. Your Company is smart to inform customers and keep them in the loop about these changes. In developing your demonstration of th
Industry News | 2016-09-16 09:09:51.0
The Balver Zinn Group a leading manufacturer of solder materials, announces that they will exhibit together with LLE Soluciones at the SMTA Mexico Expo & tech Forum on booth #17. The SMTA Expo is scheduled to take place October 5-6, 2016 at the Riu Hotel in Guadalajara, Mexico. Representatives from LLE and Balver Zinn will display the company’s OT2M solder paste, Brilliant B2012 solder wire, SN100C® alloy along with the latest flux technology.
Industry News | 2016-09-19 19:58:07.0
The Balver Zinn Group announces that they will exhibit together with LLE Soluciones at the SMTA Mexico Expo & tech Forum on booth #17. The SMTA Expo is scheduled to take place October 5-6, 2016 at the Riu Hotel in Guadalajara, Mexico. Representatives from LLE and Balver Zinn will display the company’s OT2M solder paste, Brilliant B2012 solder wire, SN100C® alloy along with the latest flux technology.
ALPHA® Telecore XL-825 lead-free cored solder wire minimizes spattering in hand soldering operations, thus reducing circuit board contamination and enhancing worker safety and comfort.
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-selection-guide
. IPC classification is usually ROL0, ROL1, ROM0, or ROM1. RMA flux residue is clear and soft. Most are non-corrosive and non-conductive
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
sandwiches, consisting of an ENIG-plated FR4 substrate on either side with solder preform between. The solder alloys used were either 99.99In, 97In/3Ag, and 90In/10Ag. Importantly, they were pre-flux coated during the manufacturing process with 1232 LV2K (ROL0
