Electronics Forum: dpak voids (8)

Criteria for thermocouple wire attachment

Electronics Forum | Thu Dec 21 21:37:19 EST 2006 | Jack

Hi Pavel, Real Chunks, Thanks for your valuable inputs..Selecting the correct location for board profiling is critical in determining the solder joint quality. Am I right to say TC wire attachment locations priority should be as below: (1) Thermal

Aperture shape for DPAK

Electronics Forum | Tue Sep 24 10:09:52 EDT 2013 | leigh

Windowpane your ground planes, this will prevent a lot of voiding.

__FOOTER__

Industry News: dpak voids (3)

Indium Corporation Names Silver Quill Award Winners

Industry News | 2019-01-16 20:44:36.0

Indium Corporation has acknowledged several of its employees with the annual Silver Quill Award.

Indium Corporation

Indium Corporation Experts to Present at IPC APEX Expo

Industry News | 2019-01-08 20:28:27.0

Several Indium Corporation technical experts will share their knowledge at the IPC APEX Expo in San Diego, Calif., USA, Jan. 29-31.

Indium Corporation

__FOOTER__

Express Newsletter: dpak voids (106)


dpak voids searches for Companies, Equipment, Machines, Suppliers & Information

Best SMT Reflow Oven

World's Best Reflow Oven Customizable for Unique Applications
Selective Soldering Nozzles

High Throughput Reflow Oven
2024 Eptac IPC Certification Training Schedule

Training online, at your facility, or at one of our worldwide training centers"
PCB Handling Machine with CE

High Precision Fluid Dispensers
SMT spare parts

Low-cost, self-paced, online training on electronics manufacturing fundamentals