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Industry Directory | Equipment Dealer / Broker / Auctions
Maynards Europe is an European industrial auctioneer based in Germany and part of the global Maynards Industrial Group. We're selling high quality, preowned machines and equipment from all kind of industries.
Industry Directory | Consultant / Service Provider / Distributor / Equipment Dealer / Broker / Auctions / Manufacturer
Salescon Ltd is operating for 20 years. Supplying various materials,tools machines for the electronic industry. Supplier for manufacturer companies in Hungary and CEE,providing services for SMEs and start-up businesses.
A500, A600, A800 - 5, 6 or 8 top/bottom cooling zones. Heating System: Up to eight groups of top and bottom forced hot air convection heating zones. Patented heating plates in each zone uniformly transfer heat to the PCBs using forced hot air co
S8, S10, S12 - 8, 10 or 12 top/bottom cooling zones. Heating System: Up to twelve groups of top and bottom forced hot air convection heating zones. Patented heating plates in each zone uniformly transfer heat to the PCBs using forced hot air con
Electronics Forum | Mon Feb 11 17:07:07 EST 2008 | blnorman
3145 is methoxy cure, so the cure by product is methanol.
Electronics Forum | Wed Mar 02 11:00:27 EST 2005 | prabhu_jude
But our requirement is that the conditioning unit has to be kept at a distance from the sensor. Is there any compensation circuit available to reduce the noise effect?
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Used SMT Equipment | Pick and Place/Feeders
JUKI2050 2060 2070 2080 and JUKI High Speed Machine Due to the lack of company stock JUKI used mounter, The customer placed a device order to see which boss had an idle machine to sell, pls contact with me. Becky Su becky@hysmt.cn
Used SMT Equipment | SPI / Solder Paste Inspection
PARMI/SPI SPIHS60 MACHINE PARMI HS60 (supreme) solder paste thickness tester SPI The SPI HS60 (supreme) series is the next generation fastest online solder paste inspection system on the market. The measurement speed at a resolution of 13x13um is
Industry News | 2017-09-16 02:29:39.0
Heller Industries has been awarded the 2017 Global Frost & Sullivan Company of the Year Award for its surface mount technology (SMT) soldering equipment that enables Industry 4.0. - the automation and data exchange in manufacturing technologies.
Industry News | 2013-08-15 20:58:22.0
Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
Parts & Supplies | Pick and Place/Feeders
GFC-Y01 YAMAHA Feeder Storage Cart The feeder storage cart gives your operators a secure place to put unused feeders between set-ups minimizing failures due to improper storage or handling. When its time to change over to the next job, the cart is
Parts & Supplies | Pick and Place/Feeders
GFC-P01 PANASERT MSR Feeder Storage Cart The feeder storage cart gives your operators a secure place to put unused feeders between set-ups minimizing failures due to improper storage or handling. When its time to change over to the next job, the
Technical Library | 2008-10-15 20:16:12.0
Solder paste dispensing is usually considered a slow process. Due to the speed advantages, screen printing is used to apply solder paste whenever possible. However, screen printing is not always an option. Leveraging the high speed of piezo drive technology opens the door to a broad range of solder paste dispensing applications. The ability to dispense dots under 300-μm diameter, even as small as 125 μm, enables BGA rework, small geometry deposits for miniaturized passive components, electrical connections in recessed cavities, and RF shield attach for handheld devices.
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
The natural sustainable desiccant solution for moisture controlled packaging Desiccants are hygroscopic (moisture-adsorbent) substances that are packaged and used to protect a broad range of products from degradation due to moisture, helping to main
If you have any inquiry, just feel free to contact bella@qy-smt.com. Compatible Strip Board such as Glass fiber board, aluminum board, etc
Training Courses | | | IPC-6012 Specialist (CIS)
The Certified IPC-6012 Specialist (CIS) training covers design, fabrication and inspection of rigid printed boards.
Training Courses | | | IPC-600 Specialist (CIS)
The Certified IPC-600 Specialist (CIS) training targets quality assurance and acceptance of bare printed circuit boards.
Events Calendar | Thu Mar 25 00:00:00 EDT 2021 - Thu Mar 25 00:00:00 EDT 2021 | ,
Webinar: Process Control to Ensure Electrochemically Reliable Electronics
Events Calendar | Tue Oct 15 00:00:00 EDT 2024 - Thu Oct 17 00:00:00 EDT 2024 | ,
GfKOOR Series | Seminar Application and Utilisation of Protective Coatings for Electronic Assemblies
Career Center | Phoenix, Arizona USA | Engineering,Management,Production,Quality Control,Technical Support
OEM that outsources internationally needs Quality Manager due to GROWTH. ISO implementation IPC 610 Supplier quality, OUTSOURCING a must, OEM or CEM side.
Career Center | Atlanta, Georgia USA | Engineering
Analog Electrical Engineer BSEE with at least 8 years experience in analog circuit design. Provide analog circuit design capabilities relative to communication circuitry, low noise amplifiers, voltage regulators, AGC circuitry, and multiplexers for
Career Center | san jose, California USA | Engineering
Process Eng, Quality supllier, Fianl QA PCBA, BOX build , SAP, Agile, Excell , mir sof word.box build product
Career Center | binan city, Laguna Philippines | Engineering,Maintenance,Technical Support
6.5 Years Experience in Semiconductor Industry Specializing in Dispensing process and Equipment. 5.0 Years of Experience in Field Service Engineering. Machine Commissioning / Customer support 24 / 7, Technical Support for Customer machine and process
SMTnet Express, April 30, 2015, Subscribers: 22,686, Members: Companies: 14,334 , Users: 38,119 Signal Transmission Loss due to Copper Surface Roughness in High-Frequency Region Elaine Liew; Mitsui Copper Foil Malaysia, Shah Alam Malaysia, Taka
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