Electronics Forum | Fri Apr 05 11:18:20 EST 2002 | habs24
Anyone have experience using Dupont CB100 for high aspect ratio via fills? Or even where I could get more information on the processes involved? Thanks in advance...
Electronics Forum | Fri Apr 05 12:09:51 EST 2002 | davef
Conductive Silver Epoxy Holefill Process Dupont CB100 (Note: Dupont Recommendations) * Board Thickness: 0.008" to 0.085" * Drilled Via Size: 0.008" to 0.018" * Aspect Ratio: 1:1 to 6:1 On learning more, try: * http://www.ipc.org/html/S17-4a.pdf * Du
