Industry Directory | Manufacturer's Representative
Alliance Sales (Europe) Ltd,is a leading supplier of semiconductor equipment in the UK, Ireland and Scandinavia, including front and back end equipement.
The Lansmont PDT-56ED is the enhanced version of the PDT-56. This Drop Tester is perfect for those applications where drop heights are frequently changed or heavier packages need to be tested. The PDT-56ED features an electric hoist for raising and
Electronics Forum | Wed Nov 29 14:58:42 EST 2006 | eds
Does anyone have or know of a Polar Instruments ToneOhm 950 Short Locator, that they are willing to part with? Please advise.
Electronics Forum | Mon Jan 16 10:42:49 EST 2006 | pjc
Try Ed Fortuna at IRT 603-759-2953 or http://www.tndservice.com/ These are for the wave bye the way.
Used SMT Equipment | Pick and Place/Feeders
This machine haS been upgraded from PF3 to PF4 CPU as well as VVG2 ED-3D board and latest Tpsys 5.1.1 software in July of 2020. Includes conveyors.Magazines and inserts are available. New 09/2012. See more on my web site at www.petlock,com.
Used SMT Equipment | Pick and Place/Feeders
FOR SALE: Make: Tyco/QUAD Model: QSX-1 Vintage: 1999 Description: P4 Head Assortment of 50 various Nozzles Includes (5) five 0201/0402 feeders, (25) 8mm feeders, (8) 12mm feeders, and (2) 16mm feeders Unit still und
Industry News | 2003-06-20 08:54:22.0
Service Pack 1 for P-CAD 2002 released today
Industry News | 2009-07-09 12:26:58.0
Edward A. Morris, Lockheed Martin Corporation will present "Managing a Perfect Storm: Pb-Free Electronics Risks"
Parts & Supplies | Pick and Place/Feeders
Edding 751 paint marker white
Parts & Supplies | Pick and Place/Feeders
ED-distributor compl. / C+P20
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2021-09-21 20:36:45.0
The present paper gives an overview of surface failures, internal nonconformities and solders joint failures detected by microscopic analysis of electronic assemblies. Optical microscopy (stereomicroscopy) and Fourier-Transform- Infrared (FTIR) microscopy is used for documentation and failure localization on electronic samples surface. For internal observable conditions a metallographic cross-section analysis of the sample is required. The aim of this work is to present some internal and external observable nonconformities which frequently appear in electronic assemblies. In order to detect these nonconformities, optical microscopy, cross section analysis, FTIR-microscopy and scanning electron microscopy with energy dispersive spectrometry (SEM-EDS) were used as analytical techniques.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Training Courses | | | PCB Inspection Courses
The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.
Events Calendar | Tue Sep 10 00:00:00 EDT 2019 - Tue Sep 10 00:00:00 EDT 2019 | Huntsville, Alabama USA
IPC Tech Ed - Process and Acceptability Requirements: Utilizing J-STD-001 and IPC-A-610 Together
Events Calendar | Tue Dec 03 00:00:00 EST 2019 - Tue Dec 03 00:00:00 EST 2019 | Anaheim, California USA
IPC Tech Ed - Process and Acceptability Requirements: Utilizing J-STD-001 and IPC-A-610 Together
Career Center | St. Paul, Minnesota USA | Production
Currently seeking an individual with experience operating Univerals Instruments Corporation Through Hole Insertion Equipment. Basic electronics assembly work and other duties as assigned. Please contact me for details. Thank you, Ed
Career Center | Palmdale, California USA | Engineering,Quality Control
The ed candidate will identify circuit board electronic assembly quality trends and take the necessary steps to resolve quality issues, with a focus on root cause analysis and verification of effectiveness. Will also develop and initiate standards a
Career Center | , Pennsylvania USA | Engineering,Production,Quality Control,Research and Development
SKILLS Quote preparation for RFQ projects. Exposure to IPC A 610 and IPC A 600. Knowledge of Potential Failure Mode Effect Analysis (PFMEA), Process control plan (PCP) for new products, based on the Critical to Quality (CTQs). Knowledge in handli
Career Center | Poway, California USA | Engineering,Production
Technically qualified in proper operation, troubleshooting, installation /dismantling, programming and preventive maintenance of SMT (Surface Mount Technology) machines. Productivity and quality for the production of PCBA (Printed Circuit Board Ass
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf
). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS). Introduction The increasing awareness of health risk associated with lead (Pb
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