Layer Count: 2L Board Thickness: 0.8mm Dimension: 140*85mm Material: Rogers RO5880 Surface Copper: 35μm Min Hole Diameter: 2.0mm Min line Width/Space: N/A Surface Finish: ENIG Do you need a PCB for special signal requirement into your products? High
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Layer Count: 8L Board Thickness: 1.0mm Panel Dimension:190*86mm/2up Material: S1141 Copper on board surface: 35μm Min Hole Diameter: 0.1mm Min line Width/Space: 8/8mil Surface Finish: ENIG+Selective OSP in BGA area This quick turn PCB is manufacture
Electronics Forum | Mon Nov 28 09:46:24 EST 2005 | pjc
I have waved gold (ENIG) boards. That's a pretty hot pot at 260C, wow. I have used 245C with good results. All other parameters look OK a glance. Well, PCB temp looks a little hot too at 130C before pot. 90-100C is typical for most No-Clean flux. At
Electronics Forum | Thu Jul 06 23:59:11 EDT 2017 | heros_electronics
We got an inquiry from US that requires high volume 8 layer 1.0mm PCB, OSP + selective ENIG surface, 5 groups impedance control, and stacked vias. These requirements are common, but there is 2/2mil lines in inner layers. It's said that this order was
Technical Library | 2018-07-11 22:46:13.0
For a demanding automotive electronics assembly, a highly thermal fatigue resistant solder alloy is required, which makes the lead-free Sn-Ag-Cu type solder alloy unusable. Sn-Ag-Bi-In solder alloy is considered as a high reliability solder alloy due to significant improvement in thermal fatigue resistance as compared to a standard Sn-Ag-Cu alloy. The alloy has not only good thermal fatigue properties but it also has superior ductility and tensile strength by appropriate addition of In; however, initial results indicated a sub-par performance in joint reliability when it is soldered on a printed circuit board (PCB) with Electroless Nickel Immersion Gold (ENIG) surface finish. Numerous experiments were performed to find out appropriate alloying element which would help improve the performance on ENIG PCBs. Sn-Ag-Bi-In solder alloys with and without Cu additions were prepared and then tests were carried out to see the performance in a thermal fatigue test and a drop resistance test.to investigate the impact of Cu addition towards the improvement of joint reliability on ENIG finish PCB. Also, the mechanism of such improvement is documented.
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipc-standards-for-manufacturing-assembly_topic877_post9030.html
IPC Standards for Manufacturing & Assembly - PCB Libraries Forum Forum Home > PCB Library Expert > Questions & Answers New Posts FAQ Search Events Register Login IPC Standards for Manufacturing
Imagineering, Inc. | https://www.pcbnet.com/blog/understanding-the-pcb-fabrication-process-from-design-to-delivery/
. Standard PCBs have a Tg of 130˚C, while high-performance boards have a Tg above 170˚C. PCB Material Choices FR-4 is a common choice for PCB substrates since the standard version has a Tg 135˚C
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