Electronics Forum | Fri Feb 10 11:10:21 EST 2017 | duoman
I've been using the ERSA Versaflow 3/45 for 3 years. I've been changing the gassing rings and seals annually, but I'm going to a schedule of every 6 months. I blow my gassing rings off with compressed air. I also blow a little into the intake tube to
Electronics Forum | Wed Feb 08 22:05:54 EST 2017 | cromaclear
Hello to all, I am using ersa versaflow 3 selective soldering machine, i am having problems with nitrogen gas ring contamination. How can i clean this rings,what do you use? Ultrasonic bath maybe?
Industry News | 2017-01-23 10:42:18.0
Kurtz Ersa North America has completed its financial results for 2016 and announces its third record setting year in all regions of the world.
Industry News | 2016-02-15 20:36:38.0
Kurtz Ersa North America will exhibit in Booth #1326 at the 2016 IPC APEX EXPO, scheduled to take place March 15-17, 2016 at the Las Vegas Convention Center. Ersa will introduce its new line of selective solder, reflow and rework equipment and more.
Technical Library | 2019-10-10 00:26:28.0
Voids are a plague to our electronics and must be eliminated! Over the last few years we have studied voiding in solder joints and published three technical papers on methods to "Fill the Void." This paper is part four of this series. The focus of this work is to mitigate voids for via in pad circuit board designs. Via holes in Quad Flat No-Lead (QFN) thermal pads create voiding issues. Gasses can come out of via holes and rise into the solder joint creating voids. Solder can also flow down into the via holes creating gaps in the solder joint. One method of preventing this is via plugging. Via holes can be plugged, capped, or left open. These via plugging options were compared and contrasted to each other with respect to voiding. Another method of minimizing voiding is through solder paste stencil design. Solder paste can be printed around the via holes with gas escape routes. This prevents gasses from via holes from being trapped in the solder joint. Several stencil designs were tested and voiding performance compared and contrasted. In many cases voiding will be reduced only if a combination of mitigation strategies are used. Recommendations for combinations of via hole plugging and stencil design are given. The aim of this paper is to help the reader to "Fill the Void."
SMTnet Express, July 3, 2019, Subscribers: 32,112, Companies: 10,820, Users: 24,903 Reduce Pollution of Process Gasses in an Air Reflow Oven Credits: Vitronics Soltec The introduction of lead-free solders resulted in a selection of different
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