Industry Directory | Manufacturer
We Buy Excess & Surplus Electronic Components Inventory - Excess Electronic
ExcessChip Technology Limited specializes in buying excess inventory of semiconductors and electronic components.
Real Time Process Control with FPC: Fluid Pressure Control (Patented) Runs your pump at optimal levels at all times instead of starving or drowning it with inadequate or excessive fluid flow from the reservoir Real Time Process Control (FPC) is a b
New Equipment | Test Equipment
Koh Young KY8030-3 3D Inline SPI component Range: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:800kg Product description: Koh Young KY8030-3 3D Inline SPI, component Range: 01005, PCB size:350x330mm, Dimension:1000x1335x1627mm, weight:
Electronics Forum | Fri Jul 30 17:20:09 EDT 2004 | Francois Monette
A couple of other potential issues are moisture/reflow related issues. This can include internal delaminations inside the component, potentially breaking or lifting the wirebonds. It may also induce warpage where the corners of the BGA will curl up.
Electronics Forum | Fri May 29 08:22:09 EDT 2009 | scottp
It would help to see pictures, but I suspect the parts are seeing excessive strain when snapped into or removed from the pallet.
Used SMT Equipment | AOI / Automated Optical Inspection
OMRON AOI VT-RNS2-L Omron AoiVT-RNSⅡ parameters Hardware part LSIZE Image signal input part Camera 3CCD camera Lighting series Ring LED (R.G.B) Image resolution 10, 15, 20um Mechanism part Transmission method Belt transmission method Producti
Used SMT Equipment | Pick and Place/Feeders
Samsung SM411 parameters To the way the flight vision Number of Spindles 6 Spindles x 2 Gantry Mounting Speed Flying Vision Chip 1608 SOP 42,000 CPH (IPC9850) 30,000 CPH (IPC9850) Mounting accuracy Chip ± 50 μ @ 3σ / Chip (Base
Industry News | 2010-12-07 14:53:07.0
GPD Global announces that its Positive Cavity Displacement (PCD) technology is proven with silver-filled electrically and thermally conductive adhesives.
Industry News | 2003-06-10 08:16:44.0
The following text describes the application of NWA Quality Analyst to quality control in the assembly of electronic components.
Parts & Supplies | Pick and Place/Feeders
Advantages of JUKI electric feeder With the electronic parts more sophisticated, more and more small, the use of electric feeder has become the standard placement of the placement machine, the old placement machine can use electric feeder has becom
Parts & Supplies | Repair/Rework
Three independent heaters control systems. FG-P6000 is available heating portion of the PCB board by hot-air circulate both from top and bottom at the same time. With large IR bottom heating, it can completely avoid PCB deformation during reworking
Technical Library | 2014-03-06 19:04:07.0
Over the last few years, there has been an increase in the rate of Head-in-Pillow component soldering defects which interrupts the merger of the BGA/CSP component solder spheres with the molten solder paste during reflow. The issue has occurred across a broad segment of industries including consumer, telecom and military. There are many reasons for this issue such as warpage issues of the component or board, ball co-planarity issues for BGA/CSP components and non-wetting of the component based on contamination or excessive oxidation of the component coating. The issue has been found to occur not only on lead-free soldered assemblies where the increased soldering temperatures may give rise to increase component/board warpage but also on tin-lead soldered assemblies.
Technical Library | 2020-09-30 19:26:45.0
Introduction •Market trend: Smaller, more efficient, more powerful, run faster •ICs and other sophisticated electronic components typically operate efficiently only under a certain range of temperatures •Operational temperatures must be kept within a suitable range • Excessive heat can damage performance and can even cause system failure
Toggled in Troy, MI will be liquidating some of their excess and unused assets utilizing the online auction services of Baja Bid. The bidding for this event will open promptly at 8:00am EST on July 5th and the closing will begin at 1:00 pm EST on Jul
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board
Training Courses | | | PCB Inspection Courses
The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Wed Mar 07 00:00:00 EST 2018 - Wed Mar 07 00:00:00 EST 2018 | ,
Solder Paste Qualification Testing - SMTA Webinar
Career Center | Simi Valley, California USA | Production
SMT Operator with experience operating MYDATA or PANASONIC -- Set up electrical components on feeders, tear down set ups after production. Return excess material to the stockroom. Interpret documentation such as bill of materials & drawings. Must be
Career Center | LaGrange, Ohio USA | Purchasing
JOB DESCRIPTION TITLE: Materials Manager DEPARTMENT:Materials SUPERVISOR:Vice President WORK HRS: 7.00 A.M. TO 3.30 P.M. DUTIES & RESPONSIBILITIES: Responsible for efficient, economical procurement and management of all raw materials
Career Center | Nashville, North Carolina USA | Engineering,Maintenance,Management,Sales/Marketing,Technical Support
Screen Printer programming, maintenance, calibration Placment machine programming, mainteanance, calibration SMT Process and Manufacturing engineering Project Management New model introduction Supervision skills Training skills Leadership knowledge S
Career Center | Alleppey, Kerala India | Engineering,Production,Quality Control
Good knowledge about the operations of various PCB surface mounting machines Good communication skills
SMT Express, Volume 3, Issue No. 5 - from SMTnet.com Volume 3, Issue No. 5 Thursday, May 17, 2001 Featured Article Return to Front Page A Closer Look at Area Array Components by Gil Zweig , Glenbrook Technologies, Inc . Combining
Heller Industries Inc. | https://hellerindustries.com/solder-balls-defects/
&place machine Excessive solder paste slump after printing Sphere size of solder paste too large for pitch components being soldered Excessive moisture absorbed by solder paste Solder paste exposed
| https://www.eptac.com/soldertips/accept-or-reject-solder-contacting-component-bodies/
. For through hole components see Section 7.3.5.7 – Supported Holes, Solder Conditions – Touching Through Hole Component Body . For surface mount components see Section
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