S8, S10, S12 - 8, 10 or 12 top/bottom cooling zones. Heating System: Up to twelve groups of top and bottom forced hot air convection heating zones. Patented heating plates in each zone uniformly transfer heat to the PCBs using forced hot air con
Dual Lane SMT Reflow Oven Nitrogen soldering process dual rail conveyor Weight Appx.:3060Kg Dimension 6300*1680*1530mm Product description: 10 Zones Dual Rail Nitrogen SMT Reflow Oven KTR-1000D-N Manufacturer, Nitrogen soldering process, dual
Electronics Forum | Mon Jul 10 14:08:23 EDT 2023 | proceng1
But isn't this referring to "inside the facility"? I think he's asking about polluting the outside air.
Electronics Forum | Thu Feb 07 14:29:02 EST 2008 | jdumont
Bi monthly?!!? What are your exhausts getting clogged with? You have that much dust in the air that cleaning every two weeks is necessary?
Used SMT Equipment | Soldering - Reflow
Very Nice Vitronics Reflow Ovens For Sale! Complete in Good Running Condition! (3) units available. Listing is to purchase one. Equipment Description Vitronics Reflow Oven Model Number: XPM-1030 Year 2000 Edge Rail and Mesh Belt Combo C
Used SMT Equipment | Soldering - Reflow
Heating zones: 5 Cooling zones: 2 Total heating length: 66 in. Total cooling length: 26 in. Total process length: 127 in. Total on /off load length: 11 in. Overall system length: 138.5 in. Overall system width: 52 in. Overall system height: 5
Industry News | 2018-10-18 09:14:05.0
Lead-free processes propose new requirements on reflow soldering quality
Industry News | 2014-09-19 20:19:38.0
KYZEN is pleased to announce that Dr. Mike Bixenman will present the paper titled “QFN Design Considerations to Improve Cleaning – A Follow on Study” at the upcoming SMTA International exhibition.
Parts & Supplies | Assembly Accessories
AXPC fan Assembly 949839603998 0.8M Linking Conveyor, Single Lane, for Cooling, with 6 Fan on Top MMLC-2103.8F 0.8m Linking Conveyor, without Fan MMLC-2103.8 1KURA FAN (for Samsung Reflow SRF70i82 ) U6250MKG1 1M Conveyor With
Technical Library | 2019-07-02 23:02:05.0
The introduction of lead-free solders resulted in a selection of different chemistries for solder pastes. The higher melting points of lead-free alloys required thermal heat resistant rosin systems and activators that are active at elevated temperatures. As a result, more frequent maintenance of the filtration systems is required and machine downtime is increased.Last year a different method of cleaning reflow ovens was introduced. Instead of cooling down the process gasses to condensate the residues, a catalyst was used to maintain the clean oven. Catalytic thermal oxidation of residues in the nitrogen atmosphere resulted in cleaner heating zones. The residues were transformed into carbon dioxide. This remaining small amount of char was collected in the catalyst. In air ovens the catalyst was not seen as a beneficial option because the air extracted out of the oven was immediately exhausted into the environment. When a catalyst is used in an air environment there is not only the carbon dioxide residues, but also water. When a catalyst is used in an air reflow oven the question is where the water is going to. Will it condensate in the process part of the oven or is the gas temperature high enough to keep it out of the process area? A major benefit of using a catalyst to clean the air before it is exhausted into the environment is that the air pollution is reduced dramatically. This will make environmental engineers happy and result in less pollution of our nature. Apart from this, the exhaust tubes remain clean which reduces the maintenance of air ovens.This paper will give more detailed information of catalyst systems during development and performance in production lines.
S8, S10, S12 - 8, 10 or 12 top/bottom cooling zones. Heating System: Up to twelve groups of top and bottom forced hot air convection heating zones. Patented heating plates in each zone uniformly transfer heat to the PCBs using forced hot air con
E8, E10, E12 - 8, 10 or 12 top/bottom cooling zones. Heating System: Up to twelve groups of top and bottom forced hot air convection heating zones. Patented heating plates in each zone uniformly transfer heat to the PCBs using forced hot air con
KingFei SMT Tech | https://www.smtspare-parts.com/sale-35537071-kh5-m8501-00x-exhaust-valve-koganei-300v-03-kg7-kh5-m8501-m8502-m8504-m8596-m8501-00x.html
KH5-M8501-00X Exhaust Valve Koganei 300V-03 KG7-KH5-M8501-M8502-M8504-M8596-M8501-00X Leave a Message We will call you back soon
GPD Global | https://www.gpd-global.com/co_website/pdf/coating/SimpleCoat-Series-Facility-Specifications-23100603.pdf
: Quick disconnect for 8 mm hose Ventilation Exhaust port diameter 127 mm (5”) Exhaust flow rate 250 CFM or more Communications Communication cable Standard Ethernet connection External input SMEMA compatible Weight Approximate weight 275 kg (605 lbs