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BGA Reballing Services BEST provides BGA reballing services for your plastic-, ceramic- and metalbodied components down to 0.3mm pitch. We have the ability to develop the BGA reballing process you want with a variety of deballing methods and machine
Customer demand for highly sophisticated and ever smaller devices has made semiconductor packaging a vital contributor to system performance. As integrated circuits have become faster and more complex, the cost and performance of the interconnect bet
Electronics Forum | Mon Dec 18 13:00:34 EST 2006 | realchunks
Hi John, Depending on your board, it could make a difference. Copper finishes might leave that part of the pad exposed, which is a no-no in most places. Where as a HASL board prolly won't care if you pulled the print back. On the other end, over
Electronics Forum | Wed Jul 17 12:07:48 EDT 2002 | dragonslayr
DaveF is correct in directing you to the archives. This problem type has been discussed many times, it is quite common. Questions to ask yourself and provide us with answers are: It always happens or random? All assemblies or just one? solder paste
Industry News | 2018-10-18 08:29:16.0
How to Prevent Short Circuits to Ground in QFN Components?
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Repair parts include: CPU circuit board repair and maintenance of the I / O board, servo circuit board repair, the image processing circuit board repair, industrial CCD camera repair, frequency converter repair, PLC repair, touch screen repair, laser
Technical Library | 2009-11-05 11:17:32.0
Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint with enough of a connection to have electrical integrity, but lacking sufficient mechanical strength. Due to the lack of solder joint strength, these components may fail with very little mechanical or thermal stress. This potentially costly defect is not usually detected in functional testing, and only shows up as a failure in the field after the assembly has been exposed to some physical or thermal stress.
Technical Library | 2024-07-24 01:04:35.0
Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry recently. This package offers a number of benefits including (1) small size, such as a near die size footprint, thin profile, and light weight; (2) easy PCB trace routing due to the use of perimeter I/O pads; (3) reduced lead inductance; and (4) good thermal and electrical performance due to the adoption of exposed copper die-pad technology. These features make the QFN an ideal choice for many new applications where size, weight, electrical, and thermal properties are important. However, adoption of QFN often runs into voiding issue at SMT assembly. Upon reflow, outgassing of solder paste flux at the large thermal pad has difficulty escaping and inevitably results in voiding. It is well known that the presence of voids will affect the mechanical properties of joints and deteriorate the strength, ductility, creep, and fatigue life. In addition, voids could also produce spot overheating, lessening the reliability of the joints.
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