New Equipment | Test Equipment
Description This product is discontinued. Support life for the 8757D will be through January 1, 2016. Accessory products for the 8757D will continue to be orderable through November 30, 2014. Support life for the accessories will be through Januar
New Equipment | Test Equipment
Vigilant provides an array of component testing and verification services. Not only do we test and verify all electronic components we source, but we can also provide a full component test and verification service for components our customers have p
Electronics Forum | Mon Sep 19 04:27:47 EDT 2005 | dougs
Check your power supplies, we had same fail a while back on VIP98 faulty power supply was the cause
Electronics Forum | Mon Jul 07 09:47:50 EDT 2008 | davef
Dye & pry test reveals the solder connections that have failed prior to performimng the test.
Used SMT Equipment | General Purpose Test & Measurement
Takaya APT-820S Flying Probe Tester Model: APT-820SYear of Manufacture: 2007Serial number: V7F56002Protection: IP-4X2 movable probes for medium board sizes up to 255 mm x 330 mmVoltage: 220V, AC, Single Phase, 50/60 HzPower: 2.0 kVAMade in Japan 100%
Used SMT Equipment | In-Circuit Testers
Agilent 8753ES-011 Vector Network Analyzer Agilent 8753ES 30 Khz to 3 or 6 Ghz Vector Network Analyzer Includes - Calibration Certificate The Agilent 8753ES vector network analyzer allows complete characterization of RF components. The 8753ES
Industry News | 2009-06-05 07:47:18.0
Paul Nickelsberg, spoke at MDG Forum: Why medical devices fail and what you need to do to prevent it from happening
Industry News | 2007-02-05 13:03:47.0
Multi-tech Stencil Cleaner provides ultimate chemistry flexibility
Technical Library | 2023-04-17 17:05:47.0
In an ideal world, manufacturing devices would work all of the time, however, every company receives customer returns for a variety of reasons. If these returned parts contributed to a fail, most companies will perform failure analysis (FA) on the returned parts to determine the root cause of the failure. Failure can occur for a multitude of reasons, for example: wear out, fatigue, design issues, manufacturing flaw or defect. This information is then used to improve the overall quality of the product and prevent reoccurrence. If no defect is found, it is possible that in fact the product has no defect. On the other hand, the defect could be elusive and the FA techniques insufficient to detect said deficiency. No-clean flux residues can cause intermittent or elusive, hard to find defects. In an attempt to understand the effects of no-clean flux residues from the secondary soldering and cleaning processes, a matrix of varying process and cleaning operation was investigated. Of special interest, traveling flux residues and entrapped residues were examined, as well as localized and batch cleaning processes. Various techniques were employed to test the remaining residues in order to assess their propensity to cause a latent failure. These techniques include Surface Insulation Resistance1 (SIR) testing at 40⁰C/90% RH, 5 VDC bias along with C32 testing and Ion Exchange Chromatography (IC). These techniques facilitate the assessment of the capillary effect the tight spacing these component structures have when flux residues are present. It is expected that dendritic shorting and measurable current leakage will occur, indicating a failing SIR test. However, since the residue resides under the discrete components, there will be no visual evidence of dendritic growth or metal migration.