Industry Directory | Research Institute / Laboratory / School
MUAnalysis is an independent lab for Component Failure Analysis and Reliability Testing in Ottawa, Ontario Canada. We also would be pleased to discuss your analysis needs. We also perform all non-destructive testing ...
Ma-tek is aimed to be the first tier service lab in the professional field of materials and failure analysis service. Applying a variety of analytical techniques, ma-tek is able to engage the best R&D partnership with customers in high tech industry.
New Equipment | Assembly Services
If you are an EMS provider or OEM of electronic/electrical components or sub-assemblies incorporating plastics, metals, ceramics or any combination of these, BEST Inc can offer you knowledgeablePCB x-ray inspection services. BEST experiences in thes
Electronics Forum | Mon Jul 30 20:38:02 EDT 2012 | davef
I'm with you on microcracking. The best way to confirm this is through sectioning of the affected capacitors. You're fortunate to be seeing these failures showing-up early in your product life. Of times these failures don't appear for years.
Electronics Forum | Wed Aug 22 12:44:26 EDT 2012 | rway
I would look at your de-paneling process. How are you cutting the boards? This could be inducing mechanical stress on the component; especially if the part is close to the edge of the pcb and perpendicular to it.
Used SMT Equipment | X-Ray Inspection
Nordson DAGE XD7600NT Ruby X-Ray Inspection Machine Nordson DAGE XD7600NT Ruby X-Ray Inspection Machine Vintage: Year 2014 PCB Direction: Left to Right Condition: Refurbished, working Running Hours: Series Number:X215914 Missing Parts: No Warra
Used SMT Equipment | X-Ray Inspection
• Nordson DAGE VR950 new technology, open, transmissive X-ray tube: -All voltages can reach <0.95 micron feature resolution – The highest voltage is 160KV, target power: 3W -Long service life of filament components -Automatic st
Industry News | 2003-05-28 08:28:54.0
For June 2-4 (Mon. - Wed.)Design Automation Conference 2003
Industry News | 2003-03-12 08:28:44.0
CAM350 Release 8 is aimed at allowing engineering and manufacturing groups to detect and fix potential PCB fabrication problems earlier in the process.
Parts & Supplies | Pick and Place/Feeders
JUKI 2050 machine failure solution KE2050M Z-axis fault E620014 error handling method! Suddenly heard the sound of the machine. The machine stopped the fault for the E620014Z axis drive alarm. View the drive. For Z drive 1, the third light is on
Parts & Supplies | Pick and Place/Feeders
Material for Failure Analysis, English
Technical Library | 2023-07-22 02:26:05.0
Patch offset; Uneven patches throughout the substrate (each substrate is offset in a different way); Only part of the substrate is offset; Only certain components are offset; The patch Angle is offset; Component absorption error; Laser identification (component identification) error; Nozzle loading and unloading error; Mark (BOC mark, IC mark) identification error; Image recognition error (KE-2060 only); Analysis of the main reasons for throwing material. More information about KINGSUN please Contact US at jenny@ksunsmt.com or visit www.ksunsmt.com
Technical Library | 2010-01-13 12:34:10.0
Micro-sectioning (sometimes referred to as cross-sectioning)is a technique, used to characterize materials or to perform a failure mode analysis, for exposing an internal section of a PCB or package. Destructive in nature, cross-sectioning requires encapsulation of the specimen in order to provide support, stability, and protection. Failures that can be investigated through micro-sectional analysis include component defects, thermo-mechanical failures, processing failures related to solder reflow, opens or shorts, voiding and raw material evaluations.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Training Courses | | | PCB Inspection Courses
The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Tue Sep 22 00:00:00 EDT 2020 - Tue Sep 22 00:00:00 EDT 2020 | Eden Prairie, Minnesota USA
Risk Analysis in Electronic Assemblies
Events Calendar | Mon Mar 16 00:00:00 EDT 2020 - Mon Mar 16 00:00:00 EDT 2020 | ,
BGA & Area Array Failures, Causes & Corrective Actions Online Webinar
Career Center | Florham Park, New Jersey USA | Engineering
Field Service Engineer Job Description The basic function of this position: Installation, training, repair, and implementation of retrofits on the complete line of Heller reflow ovens. Candidate must be a US citizen. DUTIES AND RESPONSIBILITIES: S
Career Center | , Maryland USA | Engineering
Late stage start-up company, well into commercialization, that develops and manufactures products to precisely control the instantaneous release of heat energy for reaction initiation and joining applications. Building from its strengths in material
Career Center | , Minnesota | Engineering,Management,Production,Quality Control,Technical Support
Engineer with a diverse background in management, quality, computer and customer service. Experience includes optics, electrical, mechanical, physics, chemistry, process and systems engineering, implementing computers and computer applications for m
Career Center | , Minnesota USA | Engineering,Management,Production,Quality Control,Technical Support
Engineer with a diverse background in management, quality, computer and customer service. Experience includes optics, electrical, mechanical, physics, chemistry, process and systems engineering, implementing computers and computer applications for m
Ceramic to Plastic Packaging If you don't see images please visit online version at: http://www.smtnet.com/express/ Ceramic to Plastic Packaging As electronic products increase in functionality and complexity, there is an emphasis
| https://www.eptac.com/soldertips/problems-with-stress-cracks-in-ceramic-components/
SolderTips: Problems With Stress Cracks in Ceramic Components | EPTAC Skip to content Scroll Toll Free: 800.643.7822 Toggle navigation Training All Classes
Surface Mount Technology Association (SMTA) | https://www.smta.org/iceet/workshops.cfm
: Failure Analysis of Electronic Devices M. Simard-Normandin, Ph.D., MuAnalysis Inc. Course Objectives: The supply chain of electronic devices is large and complex