Industry Directory: failure modes (6)

Dyadem International Ltd.

Industry Directory |

Dyadem develops FMEA-Pro� 5, a revolutionary software tool that enables you to efficiently perform Failure Modes and Effects (FMEA) Analysis studies of manufactured products from the automotive, aerospace, defence and consumer electronics industries.

Custom Analytical Services Inc.

Industry Directory | Other

Failure analysis - Components as well as PC boards, Discretes, Passives ICs - offering X-ray. SEM/EDX -XRF - Cross sectioning complete root cause F/A

New SMT Equipment: failure modes (34)

PCB Surface Cleaning Machine SMM-450

PCB Surface Cleaning Machine SMM-450

New Equipment | Cleaning Equipment

PCB Surface Cleaning Machine SMM-450 PCB Surface Cleaning Machine SMM-450 The PCB Cleaning Machine is used to remove filth on the surface of PCB. Technical Parameters 1. Independent innovation patent design (patent: 2017SR471774), the industry's

Qinyi Electronics Co.,Ltd

FMEA/FMECA Software

FMEA/FMECA Software

New Equipment |  

FMEA-Pro� 5 is a revolutionary software tool that enables you to perform a Failure Modes and Effects Analysis of manufactured products from the automotive, aerospace, defense and consumer electronics industries, to name just a few. This program is fu

Dyadem International Ltd.

Electronics Forum: failure modes (85)

what are the main diffrences in failure modes for Bga

Electronics Forum | Sat Jul 05 14:07:33 EDT 2008 | shellydhami

Main diffrences in failure modes for mechanically and thermally induced BGA solder joint fracture

what are the main diffrences in failure modes for Bga

Electronics Forum | Thu Jul 10 22:44:54 EDT 2008 | davef

Too complicated to answer. Wudda you say that you post pix and we'll tell you what we think?

Used SMT Equipment: failure modes (46)

Tektronix 371A

Tektronix 371A

Used SMT Equipment | General Purpose Test & Measurement

The 371A , the industry leader in high power curve tracers is used for testing a wide variety of power semiconductors. It performs DC parametric characterization of thyristors, SCRs, IGBTs and power MOSFETs. The high voltage collector mode permits te

Test Equipment Connection

Anritsu S331E

Anritsu S331E

Used SMT Equipment | In-Circuit Testers

Anritsu S331E Anritsu S331E Sitemaster - Anritsu is pleased to introduce its eighth-generation compact handheld Site Master cable and antenna analyzer series with integrated spectrum analyzer. The new Site Master analyzers offer the same ease of

Test Equipment Connection

Industry News: failure modes (104)

Call for Participation — Deadline Extended to 2/21/20!

Industry News | 2020-02-18 14:31:52.0

Join us for High Reliability Forum as a presenter or instructor and share your expertise in electronics with high reliability requirements.

Association Connecting Electronics Industries (IPC)

Early Bird Deadline Approaching For SMTA Boston Academy

Industry News | 2009-03-12 18:15:08.0

SMTA Boston will be held April 22-23, 2009 at the Boston Convention Center in conjunction with Electronics New England and NEPCON East.

Surface Mount Technology Association (SMTA)

Parts & Supplies: failure modes (1)

Panasonic VALVE

Panasonic VALVE

Parts & Supplies | SMT Equipment

  N610073252AA Main Body:NPM 1043889510AA ADJUST BOLT N610084824AA Label(Main Body):NPM N610073372AA Main Body (H):NPM N610073583AA CPU BOX & Wiring:NPM N610058919AM POWER UNIT:NPM N610087627AA Operation parts (H):NPM N610052923AA X-Axis:NP

QYSMT SOLUTION USA LLC / Qinyi Electronics Co.,Ltd

Technical Library: failure modes (25)

Optimizing Reflowed Solder TIM (sTIMs) Processes for Emerging Heterogeneous Integrated Packages

Technical Library | 2023-01-17 17:12:33.0

Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.

Heller Industries Inc.

Micro-Sectioning of PCBs for Failure Analysis

Technical Library | 2010-01-13 12:34:10.0

Micro-sectioning (sometimes referred to as cross-sectioning)is a technique, used to characterize materials or to perform a failure mode analysis, for exposing an internal section of a PCB or package. Destructive in nature, cross-sectioning requires encapsulation of the specimen in order to provide support, stability, and protection. Failures that can be investigated through micro-sectional analysis include component defects, thermo-mechanical failures, processing failures related to solder reflow, opens or shorts, voiding and raw material evaluations.

BEST Inc.

Videos: failure modes (15)

PCB Router Cutting Machine ML 2500S

PCB Router Cutting Machine ML 2500S

Videos

ML-2500S PCB Separator uses high speed rotation milling cutter to separate PCB array. Widely applied in digital, communication, lighting, etc. Which improved the defect on PCB separating caused by manual, V-cut, stamping, etc If you have any questi

Qinyi Electronics Co.,Ltd

PCB Surface Cleaning Machine MLPCM-450

PCB Surface Cleaning Machine MLPCM-450

Videos

PCB Surface Cleaning Machine MLPCM-450 Technical Parameters 1. Independent innovation patent design (patent: 2017SR471774), the industry's first, lets you have the most advanced contact cleaning system in the industry. 2. Using Panasonic PLC program

Qinyi Electronics Co.,Ltd

Training Courses: failure modes (3)

Costly Controversial ESD Myths

Training Courses | | | ESD Control Training Courses

Browse training and certification programs for electrostatic discharge (ESD) control in electronics assembly.

EOS/ESD Association, Inc.

Design for Testability and for Built-in Self Test

Training Courses | | | PCB Design Courses

The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.

EECS at University of California

Events Calendar: failure modes (9)

Avoiding the Most Common PCB Failure Modes

Events Calendar | Thu Aug 20 00:00:00 EDT 2020 - Thu Aug 20 00:00:00 EDT 2020 | ,

Avoiding the Most Common PCB Failure Modes

Surface Mount Technology Association (SMTA)

Printed Circuit Board (PCB) Inspection & Quality Control

Events Calendar | Mon Sep 14 00:00:00 EDT 2020 - Mon Sep 14 00:00:00 EDT 2020 | ,

Printed Circuit Board (PCB) Inspection & Quality Control

Surface Mount Technology Association (SMTA)

Career Center - Jobs: failure modes (12)

SMT Technician

Career Center | Delavan, Wisconsin USA | Production

*Set up printers, placement machines and reflow ovens for production. *Adjust machine parameters and CAM programs *Optimize part placement and feeder applications through CAM programs *Manipulate SPC data for solder paste height measrurements and int

Borg Indak, Inc.

Quality Engineer

Career Center | Tulsa, Oklahoma USA | Engineering

High tech Electronics manufacturing service EMS provider is looking for a Quality Engineer. Ideal candidate should have: Good background in EMS or contract electronics manufacturing (CEM) Desired experience in any of following - aerospace, defense

Brennan and Brennan utive Search

Career Center - Resumes: failure modes (24)

Manufacturing Manager

Career Center | Stouffville, Ontario Canada | Engineering,Maintenance,Production,Quality Control,Technical Support

A versatile Facility, Manufacturing and Program Manager with over 18 years of progressive experience in the Electronic Manufacturing Service complimenting the needs of OEM/ECMs in the Automotive, Consumer and Commercial electronics and Datacom and Te

Sales

Career Center | Chennai, India | Sales/Marketing

Experience in sales of inter-connect, passive, active, and electro-mechanical components Product Engineering Role as handling BOM, ECO, ECN in the New product introduction of Philips LCD TV and Kulicke and Soffa wire bonding m/c Process and Quali

Express Newsletter: failure modes (324)

SMTnet Express - December 11, 2014

SMTnet Express, December 11, 2014, Subscribers: 23,586, Members: Companies: 14,135 , Users: 37,386 Failure Modes in Wire bonded and Flip Chip Packages Hikmat Chammas - Peregrine Semiconductor The growth of portable and wireless products is driving

SMTnet Express - February 19, 2015

SMTnet Express, February 19, 2015, Subscribers: 22,404, Members: Companies: 14,224, Users: 37,735 Numerical Study on New Pin Pull Test for Pad Cratering Of PCB Billy Hu, Jesus Tan - Flextronics Pad cratering is an important failure mode besides

Partner Websites: failure modes (101)

Call for Papers | ICEET

Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/call_for_papers.cfm

: Lead-free assembly processes Lead-free die attach soldering Nano-scale soldering materials & processes New solder paste technologies Failure modes

Surface Mount Technology Association (SMTA)

PCB Components in Automotive Revolutionizing the PCB Industry

Imagineering, Inc. | https://www.pcbnet.com/blog/how-pcbs-in-automotive-components-are-revolutionizing-the-industry/

. AI introduces a high degree of virtualization to many engineering fields. This allows engineers and designers to simulate the performance of a practically unlimited number of component designs and identify optimal variations, potential disadvantages, and failure modes

Imagineering, Inc.


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