ASYMTEK Quantum Q-6800 High-Value Fluid Dispensing System. ASYMTEK Quantum Q-6800 Series. A high-value fluid dispensing solution for demanding applications. Large dispense area (423 x 458 mm) for varied substrate sizes Supports CSP, BGA, and boa
100 different practice boards covering the entire range of SMD components: BGA, QFP, TQFP, TSOP, SOIC, discrete and chips. With fiducials. HASL and Entek available.
Electronics Forum | Fri Jun 10 14:22:53 EDT 2005 | pr
Are the local fids. necessary? Anyway, I can't think of any reason the local fids. would have to be spaced exactly the same distance from the part. We place BGA's and QFP's using board fids, and have yet to find a problem that local fids helped fix.
Electronics Forum | Fri Jun 08 13:29:14 EDT 2001 | dougt
Local fiducials will help component placement but will have no effect on part recognition. Local fiducials help you compensate for board skew or streatch by looking at a small area of the board vs. the board fiducials that cover placement over the e
Used SMT Equipment | Pick and Place/Feeders
Manncorp MC385V2-V Pick and Place Vintage: 2014 Details: Windows 7 Professional Operating System Dual Placement Heads Placement Rate (IPC-9850): 5,500 CPH
Used SMT Equipment | Pick and Place/Feeders
Windows XP Professional Operating System Single Placement Head Placement Rate (IPC-9850): 4,000 CPH Placement Rate Max: 5,000 CPH Min Component Size: 01005 Max Component Size: 100mm x 150mm Max Component Lead Pitch: 0.3mm BGA/CSP Placement Capability
Industry News | 2014-10-13 16:23:05.0
Nikon Metrology will be presenting Inspect-X 4.1 at Electronica Munich from 11-14 November, their latest release of the acquisition and analysis software for Nikon Metrology's range of X-ray and CT systems. The new technology provides improved real-time imaging and advanced BGA analysis.
Dual valves on a single platform. One valve dispenses the dam, a second valve encapsulates the cavity. http://www.nordsonasymtek.com
Career Center | Bangalore-560026, Karnataka India | Engineering,Maintenance,Technical Support
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Lewis & Clark | https://www.lewis-clark.com/
: 5,000 CPH Min Component Size: 01005 Max Component Size: 100mm x 150mm Max Component Lead Pitch: 0.3mm BGA/CSP Placement Capability Dual-Vision Alignment System Integral Vacuum Max Placement Area: 13.8″ x 17.1
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/products/fluid-dispensing-systems/quantum-q-6800-high-value-fluid-dispensing-system
and other electronic assembly applications including: CSP, BGA and board-level underfill Corner and edge bonding Dam and fill Potting and encapsulation Surface mount adhesives Conductive epoxy Larger board or substrate size
