Industry Directory | Manufacturer
A US manufacturer of quality hand tools for those engaged in the repair, rework, R & D, testing, and assembly of electronic components and printed circuit boards from Through Hole to 2Mil Pitch Surface Mount.
Industry Directory | Manufacturer
FINE PITCH ASSEMBLY. SIMPLY BETTER AT WHAT WE DO.
DEK Galaxy SMT Stencil Printer Maximum printing surface： 510 mm* (X) x 508.5 mm (Y)Printing speed: 2 mm/sec to 300 mm/secWeight: Approx. 680 kgProduct description: DEK Galaxy SMT Stencil Printer, Maximum printing surface： 510 mm* (X) x 508.5 mm (Y),
New Equipment | Solder Paste Stencils
SMT Framed Stencils are laser cut solder paste stencils designed to work on SMT printing machines. These laser cut stencils are permanently glued into a frame. These framed stencils are are designed for highly repeatable continuous operation in volum
Electronics Forum | Thu Jun 16 22:14:51 EDT 2005 | davef
16 thou pitch parts: Use a 5 thou laser cut electropolished stencil with 0.008"x0.045" apertures and type 3 solder paste. Bridges Connecting or Partially Connecting Adjacent Leads or Lands * Excessive solder paste * Excessive component placement pre
Electronics Forum | Thu Jun 16 00:24:29 EDT 2005 | mskler
Hi everybody, Can some body tell me that what stencil thicknes is required for the 16mil QFP. I am getting bridging as well as dry at QFP pins. What type of solder 1. Viscocity 2. mesh size 3. flux contents Should be used for this type
Used SMT Equipment | SMT Equipment
Product Name :Panasoinc NPM module Product number: two modules NPM Detailed product introduction 2D inspection head function of NPM tape coating machine: 1, NPM check head resolution: 9 m 2, NPM check head vision: 21.1 * 17.6mm 3, check proc
Used SMT Equipment | SMT Equipment
Product Name :Panasoinc NPM module Product number: two modules NPM Detailed product introduction 2D inspection head function of NPM tape coating machine: 1, NPM check head resolution: 9 m 2, NPM check head vision: 21.1 * 17.6mm 3, check proc
Industry News | 2003-06-04 09:19:23.0
With increasing demand for fine pitch placements and a growing amount of fast turnaround high-tech low-volume prototype work, Speedboard has invested in additional SMT/BGA placement/rework equipment.
Industry News | 2018-10-18 08:27:03.0
An Analysis of SMT Solder Paste Printing Defects
Parts & Supplies | Soldering Equipment/Fluxes
Two-Piece Fine Pitch RocHard 10 MilProbe Kit
Parts & Supplies | SPI / Solder Paste Inspection
Quick programming, friendly programming interface Multiple measurement methods True one-button measurement Eight-way motion button, one-click focus Adjustable scanning pitch Solder paste 3D simulation function Powerful SPC function MARK
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2023-07-25 16:50:02.0
Some of the new handheld communication devices offer real challenges to the paste printing process. Normally, there are very small devices like 01005 chip components as well as 0.3 mm pitch uBGA along with other devices that require higher deposits of solder paste. Surface mount connectors or RF shields with coplanarity issues fall into this category. Aperture sizes for the small devices require a stencil thickness in the 50 to 75 um (2-3 mils) range for effective paste transfer whereas the RF shield and SMT connector would like at least 150 um (6 mils) paste height. Spacing is too small to use normal step stencils. This paper will explore a different type of step stencil for this application; a "Two-Print Stencil Process" step stencil. Here is a brief description of a "Two-Print Stencil Process". A 50 to 75 um (2-3 mils) stencil is used to print solder paste for the 01005, 0.3 mm pitch uBGA and other fine pitch components. While this paste is still wet a second in-line stencil printer is used to print all other components using a second thicker stencil. This second stencil has relief pockets on the contact side of the stencil any paste was printed with the first stencil. Design guidelines for minimum keep-out distances between the relief step, the fine pitch apertures, and the RF Shields apertures as well relief pocket height clearance of the paste printed by the first print stencil will be provided.
ITW EAE, the Electronic Assembly Equipment division of ITW is introducing an innovative new twin-nozzle developed by the Vitronics Soltec team for the ZEVA Selective Soldering System. The 3D-Twin-Nozzle™ has two nozzle diameters combined in one
https://www.ascen.ltd/Products/Solder_paste_printer/513.html full auto PCB screen printer and SMT solder paste printing machine with Image and optical system,It is a very accurate fully automatic SMT stencil printer.automatic PCB screen printer main
Training Courses | | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Mon Mar 18 00:00:00 EDT 2019 - Mon Mar 18 00:00:00 EDT 2019 | ,
Webinar: Stencil Design for Solder Paste, In Process Inspection & Process Defects
Events Calendar | Wed May 31 00:00:00 EDT 2023 - Wed May 31 00:00:00 EDT 2023 | Holtsville, New York USA
Long Island Chapter Meeting: Fine Feature Paste Printing, Stencil Design and Solder Technology
Career Center | Oldsmar, Florida USA | Engineering,Maintenance,Production
Job Title: Assembler 2 – IPC 610 – 1st Shift Address: 3655 Tampa Rd, Oldsmar FL 34677 Duration: 1 year Pay Rate: $15-$18 Hours: 9/80 schedule Monday – Thursday 6:00AM – 3:30PM, Friday 6:00AM to 2:30PM Job Description: Use microscope to verify
Career Center | Oldsmar, Florida USA | Maintenance,Production
Job Description: • Uses microscope to verify correct part placement and orientation, manually align parts before soldering and perform post re-flow inspection and touch-up. • Able to identify and touch up poor wetted solder joints, solder voids / i
Career Center | , | Engineering,Production
Project Management, SMT Process Engineering
Career Center | , Israel | Engineering,Maintenance,Technical Support
I was born on June , 1972 in Khmelnitsky city , Ukraine . I am male. From 1979 to 1987 I was studying at secondary school #7, having finished which I entered the Technical College of Khmelnitsky in specialty Machine Tools with Computer Numeric Contr
Featured Article Return to Front Page Soldering Technolo
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Vacuum-Fluxless-Reflow-Technology-for-Fine-Pitch.pdf
. It’s crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application
Lewis & Clark | http://www.lewis-clark.com/product/mydata-feeders-tm8fc-8mm-fine-pitch-magazine/
Mydata/Mycronic Feeders TM8FC -8mm Fine pitch Magazine - Part# L14021C - Lewis and Clark Skip to content My Cart: 0 View Cart Checkout No products in the cart. Subtotal
.gif)
