Electronics Forum | Wed Jan 05 17:53:52 EST 2005 | SuePH
We had a contract in house that included a flex board which required an 18 hour bake at 105 degrees. The other brds got along fine with 2 hours, but the flex board would delaminate until we went to this long bake. I don't know how the engineer came
Electronics Forum | Wed Dec 22 19:09:17 EST 2004 | rohman23
Very strange...I just logged into the internet to come post this very question for all the lurking experts. We have a 16 layer rigid-flex that we have never baked. Our board vendor is expressing concern that we do not perform a pre-bake before assy
Industry News | 2010-04-10 02:09:54.0
If a picture is worth a thousand words, the new H revision of IPC-A-600, Acceptability of Printed Boards, is a priceless work of art for fabricators and assemblers, particularly inspectors and product developers. IPC — Association Connecting Electronics Industries® announces the new releases of IPC-A-600H and its companion document the C revision of IPC-6012, Qualification and Performance Specification for Rigid Printed Boards.
Industry News | 2022-01-10 16:28:20.0
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This video describes the IPC A-600 training and certification program. The IPC A-600 specification is a set of acceptability specifications for printed circuit boards. These standards determine the acceptance and reject criteria for printed wiring bo
This video describes the IPC A-600 training and certification program. The IPC A-600 specification is a set of acceptability specifications for printed circuit boards. These standards determine the acceptance and reject criteria for printed wiring bo
Training Courses | | | IPC-600 Specialist (CIS)
The Certified IPC-600 Specialist (CIS) training targets quality assurance and acceptance of bare printed circuit boards.
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The Certified IPC-600 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of bare printed circuit boards and prepare them to deliver Certified IPC-600 (CIS) training.
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/0540-csp-delaminations
- Application Note 540 Massive delamination shown in red. Sample & Method In this CSP the die is mounted to an elastomer material, which is then attached to a flex substrate with solder balls
