Industry Directory | Manufacturer
Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.
New Equipment | Rework & Repair Equipment
Desktop Reflow Oven For Reballing and Prebumping of SMD Components The new MiniOven-04 is perfectly suitable for a wide range of applications, from small QFNs to very large BGAs. This is due to our extensive selection of stencils and masks for almos
Electronics Forum | Mon Jul 12 11:35:27 EDT 2004 | Pierre RICHARD
Here are some answers to my questions after a good research. I also added more definitions that could help understand this esoteric language used in assembly, specially surrounding fluxes and their use. In blue italics are comments and extracts from
Electronics Forum | Sun Oct 13 22:19:28 EDT 2002 | mikestringer
Hi Everyone What lubricants do your maintenance people use for the chains in your Reflow ovens? The manuals for our ovens have one recommendation - but I am always open to other people�s experiences and recommendations. Another option may be easie
Used SMT Equipment | Soldering - Reflow
3°C/sec – even on large boards. Oven Length 680cm Process Gas Options Air, Nitrogen, Formic Acid, forming gas Heated Zones Convection: 10 Top / 10 Bottom IR: 3 Top Heated Length (Convection/Total) 327 cm / 430 cm Cool Zones 3 Top (Bottom Option) Max
Industry News | 2023-06-12 21:13:08.0
HELLER joined the 97th CEIA China Electronics Intelligent Manufacturing Summit Forum convened in Wuhan, garnering substantial attention from industry insiders. The conference concentrated on a wide array of fields, including optoelectronic communication, military electronics, and EV automotive electronics. With an impressive turnout of nearly 500 industry colleagues, the event proved to be an invaluable platform for networking and knowledge exchange.
Industry News | 2013-08-15 20:58:22.0
Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Nano-copper sintering in formic acid vapor.
PCB Mis Print Cleaning Machine ETA-2100 If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. PCBA Cleaning Machine, On-line PCBA Cleaning Machin
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
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Flux-Free Formic Reflow Soldering-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin Reflow oven,SMT Reflow Soldering Oven 当前位置: Home >> News >> News Flux-Free Formic Reflow Soldering Flux-Free Formic Reflow Soldering Flux-Free Formic Reflow in Formic Acid Vapor
Heller 公司 | https://hellerindustries.com.cn/video/formic-acid-sintering/
+86-21-64426180 jchen@hellerindustries.com.cn 全球支持 HELLER辦事處遍佈全球。 尋找銷售代表 備件 查找迴流焊爐和固化爐的替換零件 + - 網站導航 - 網站導航 产品 设备 回流焊炉 无空洞/真空 Reflow Ovens 甲酸/无助焊剂回流炉 压力烤箱 垂直固化炉 定制回流焊和固化炉 市场 市场 消费电子组装 表面贴装技术 半导体先进封装 功率电子 其他 应用 对流回流焊 无空洞焊接 无助焊剂焊接 固化应用 低空洞固化 SMT 热工艺解决方案的领
