Industry Directory | Manufacturer
Hitechpcba is a wоrld-lеаding PCB Manufacturing & PCB Assembly company with more than 20 years experience in the electronics manufacturing industry. We focus on Circuit board fabrication, PCB assembly, electronic parts sourcing.
Industry Directory | Manufacturer
Golden State is a contract manufacturer that makes wire harnesses, electromechanical assemblies (box builds, subassemblies, PCBAs, kits, etc.) and services (sorting, rework, value additive manufacturing engineering)
Volumetric Dispense Pump - PCD Technology revolutionizes how you dispense and how you perceive dispensing. PCD - Progressive Cavity Displacement PCD is a continuously volumetric dispense pump based on the Progressive Cavity principle. PCD technolog
New Equipment | Education/Training
IPC - Association Connecting Electronics Industries® offers globally recognized industry-traceable training and certification programs on key Electronics Industry Standards. Blackfox, founded in 1996, is the premier Worldwide Approved IPC Training Ce
Electronics Forum | Tue Feb 11 12:44:32 EST 2014 | cyber_wolf
Jigo, We have never had a need to do internal testing on solder paste, and your paste supplier should be able to tell you what the correct operating temperature range is. All of the big names in solder paste have tight quality control and I suspect t
Electronics Forum | Mon Aug 27 01:48:06 EDT 2001 | apg
Dear Hussman We use automatic machines on mounting PHILIPS and though quality and velocity of their mounting are very good, the girls occupied with quality control can not on 100 % to check quality of the soldering FLIP CHIP and BGA!!! Pavel
Used SMT Equipment | SMT Equipment
Product name: KD - 775 JUKI chip mounter Product number: KD - 775 Products in detail JUKI KD775 high-speed daub glue standard equipped with three dispensing head, achieved 0.1 seconds/launch daub adhesive at a high speed. Stable quality stand
Used SMT Equipment | Pick and Place/Feeders
Product number: KD - 775 Products in detail JUKI KD775 high-speed daub glue standardequipped with three dispensing head, achieved 0.1 seconds/launch daub adhesiveat a high speed. Stable quality standards are equipped witheven daub glue residual wi
Industry News | 2023-06-12 21:14:11.0
The 2023 Beijing Intelligent Manufacturing and SMT Technology Exchange Conference, hosted by the Intelligent Manufacturing Committee of the Beijing Electronics Society, was successfully held in Beijing on May 25th. HELLER was honored to be invited and actively participated by sharing their cutting-edge technology and expertise.
Industry News | 2017-05-03 23:42:40.0
GPD Global offers a breakthrough in uniform fluid dispensing and repeatability by ensuring a consistent fluid supply to the pump regardless of reservoir size or fluid level.
Parts & Supplies | SMT Equipment
System control power (160555) DEK system control power 160555 Description: DEK System Control Power SMPSU, 650W WIDE RANGE I / P (FASTON TERMS) (TXT) Part NO.: 160555 Applicable models: ELA / HORIZON / INFINITY、 if need more info about the
Parts & Supplies | Pick and Place/Feeders
SAMSUNG SM-J90600367C FEEDER CONTROL BOARD if need more info about the products , pls don’t hesitate to contact with us at any time.More info pls visit our website:www.ksunsmt.com. Email: alice@ksunsmt.com Skype: alice@ksunsmt.com Whats
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2023-09-16 06:24:50.0
Discover our SMT reflow oven for precise soldering in PCB assembly. Achieve optimal temperature control and quality results in your electronics manufacturing process.
This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
http://www.gpd-global.com No drip no drool across a wide range of fluid viscosities (low-to-mid and low-to-high). No manual adjustment to compensate for pump variability. Truly Volumetric PCD Pumps for total control of dispensing fluids. Ability to
Training Courses | | | IPC J-STD-001 Trainer (CIT)
The Certified IPC J-STD-001 Trainer (CIT) courses prepare individuals as qualified trainers in the area of producing high quality soldered interconnections and prepares them to deliver Certified IPC J-STD-001 Specialist (CIS) training.
Training Courses | | | IPC J-STD-001 Space Trainer (CIT)
The IPC J-STD-001 Space Addendum (CIT) certification courses allow individuals to conduct Certified IPC J-STD-001 Space Addendum Specialist (CIS) training.
Events Calendar | Wed Jul 19 00:00:00 EDT 2023 - Wed Jul 19 00:00:00 EDT 2023 | ,
SMTA Webinar: Secure, Intelligent, Detailed Design Data Exchange Between Design & Manufacturing
Events Calendar | Tue Sep 24 00:00:00 EDT 2019 - Tue Sep 24 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series - Electrostatic Discharge Control - Game Changing Threats - FREE Introduction Webinar
Career Center | Rolling Meadows, USA | Quality Control
Technical Trainer Professional solder training company is seeking individual to teach solder skills-based training as well as other electronics assembly courses. Individual should be able to communicate effectively with others. Training or teaching
Career Center | Rolling Meadows, Illinois USA | Quality Control
Job: PCB Assembly/Soldering Instructor Responsibilities: Provide instruction to students in IPC classes IPC-A-610, IPC JSTD-001, IPC 7711/21, IPC-A-620 Provide instruction to students in BEST classes Provide course content for and instruction to stu
Career Center | seoul, South Korea | Engineering
I have 4 year process engineering in Motorola and 7 years service experience in Assemblen . 2 years in Mirtec AOI as service manager .
Successfully Designing FPGA-Based Systems SMTnet Express March 15, 2012, Subscribers: 25003, Members: Companies: 8826, Users: 32832 Successfully Designing FPGA-Based Systems by: Nagesh Gupta; Cadence Design Systems, Inc. Increases in field