Electronics Forum | Wed Mar 29 23:48:39 EST 2006 | ____
Look on the serial number on the body of the feeder. If it starts with "W" it is a CP6 feeder. If it starts with "K" it is for the CP7. It really doesn't matter for which machine, it all depends on the bucket style feeder. If the feeder is a bucket s
Used SMT Equipment | Pick and Place/Feeders
Fuji NXT II M3 and M6 PCU - Pallet Change Unit (Bucket and Reel Type) Brand: Fuji Model: M3 and M6 PCU- Pallet Change Unit Part #:(PBM3C) (PUM3D) (PUM3H) (PBM3B) Type: Bucket and Reel Type Dedicated device to change feeder pallets for M6
Used SMT Equipment | Pick and Place/Feeders
FUJI NXT M6 II Feeder Pallet For NXT II and NXT Model: DP6XA 45 feeder slots With bucket
Industry News | 2012-03-22 02:30:52.0
Fuji’s new NXT IIc machine is an addition to the already popular NXT series line up and is enabling customers around the world to achieve some of the best area productivity rates in the industry. The NXT IIc is a modular scalable placing platform just like the NXT II, but manages to squeeze the same advanced mounting technology into an even more compact body. The result is an astounding performance of 59,000 cph per square meter.
Industry News | 2013-04-22 19:51:29.0
The all-in-one placement machine AIMEX II has been developed. The AIMEX II inherits concepts from the popular AIMEX, but with increased flexibility and expandability.
Parts & Supplies | Pick and Place/Feeders
1 XS03503 converyor sensor NXTII 2 K53050 PAM parts NXT&NXTII 3 MPJ2220 PAM parts CP6 CP7,CP8 4 AA0EX04 H04 JIG Nozzel NXT&NXTII 5 XK00792 parts Camera CCD NXT&NXTII 6 S4077L Sensor PM-L44P 3 NXT&NXTII 7 ADNPH8170 Vaccum pin XP1
Parts & Supplies | Pick and Place/Feeders
1 XS03503 converyor sensor NXTII 2 K53050 PAM parts NXT&NXTII 3 MPJ2220 PAM parts CP6 CP7,CP8 4 AA0EX04 H04 JIG Nozzel NXT&NXTII 5 XK00792 parts Camera CCD NXT&NXTII 6 S4077L Sensor PM-L44P 3 NXT&NXTII 7 ADNPH8170 Vaccum pin XP1
Strength of Lead-free BGA Spheres in High Speed Loading Strength of Lead-free BGA Spheres in High Speed Loading Concern about the failure of lead-free BGA packages when portable devices such as cell phones are accidentally dropped and a general
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