Electronics Forum | Mon Sep 27 09:13:46 EDT 1999 | John O'Brien
| Writing the final report for my engineering studies (microsystem technology) I'm treating the identification of PCBs from automotive applications by laser marking with a data matrix code. | | | No I'm trying to set up a programme of how to test t
Electronics Forum | Wed Sep 08 08:25:26 EDT 1999 | Brad Kendall
Listed below are the issues Viking has been experiencing since the | installation of the Proflow Head: | 1. After installing new 350mm Wiper foil with metal | strip glued on it, It worked for about a week and suddenly meta
Industry News | 2015-05-12 16:39:31.0
The SMTA announced today that JoAnn Stromberg, the association’s Executive Administrator for the past 29 years, has announced plans to retire at the end of December 2015.
Industry News | 2003-08-27 10:58:00.0
Lead free solders and embedded passives headline professional development schedule at the 2003 IPC Annual Meeting
Technical Library | 2018-10-18 15:41:45.0
One specific market space of interest to emerging printed electronics is In Mold Label (IML) technology. IML is used in many consumer products and white good applications. When combined with electronics, the In Mold Electronics (IME) adds compelling new product functionality. Many of these products have multi-dimensional features and therefore require thermoforming processes in order to prepare the labels before they are in-molded. While thermoforming is not a novel technique for IML, the addition of printed electronic functional traces is not well documented. There is little or no published work on printed circuit performance and design interactions in the thermoforming process that could inform improved IME product designs. A general full factorial Design of Experiments (DOE) was used to analyze the electrical performance of the conductive silver ink trace/polycarbonate substrate system. Variables of interest include trace width, height of draw, and radii of both top and bottom curvatures in the draw area. Thermoforming tooling inserts were fabricated for eight treatment combinations of these variables. Each sample has one control and two formed strips. Electrical measurements were taken of the printed traces on the polymer sheets pre- and post- forming with a custom fixture to evaluate the effect on resistance. The design parameters found to be significant were draw height and bottom radius, with increased draw and smaller bottom curvature radii both contributing to the circuits’ resistance degradation. Over the ranges evaluated, the top curvature radii had no effect on circuit resistance. Interactions were present, demonstrating that circuit and thermoforming design parameters need to be studied as a system. While significant insight impacting product development was captured further work will be executed to evaluate different ink and substrate material sets, process variables, and their role in IME.
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. Solder preforms can be coated, flux laminated between layers of different alloy or simply compressed cored solder wire. In the distant past some assembly operations have simply employed cored wire wrapped around a screwdriver or knitting needle and cut to form rings
