Electronics Forum: gabriel (21)

IONIC CLEANLINESS SPEC FOR BARE PWBs

Electronics Forum | Mon May 10 19:36:08 EDT 2004 | gabriele

Many Tnks Dave, always helpful is your support. I am not familiar how to access EMPF, I have tried already last wk but I was able to read only the abstract of RR0013. Is the access for free or it necessary to be a registered SMTA member ? Regards G

IONIC CLEANLINESS SPEC FOR BARE PWBs

Electronics Forum | Mon May 10 19:44:15 EDT 2004 | davef

Hi Gabriele Has the snow melted up there, yet? No, SMTA membership, while good in its own right, is not a prerequiste to ordering documents from EMPF. Select "order technical publications" here: http://www.empf.org/html/empfset.htm

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Industry News: gabriel (8)

Registration Open for IPC’s Conference on Solderability and Reliability for Electronics Assemblies in Budapest Industry experts to present on technical and business issues

Industry News | 2012-12-17 19:16:10.0

IPC — Association Connecting Electronics Industries® announces registration is now open for the IPC Conference on Solderability and Reliability for Electronics Assemblies.

Association Connecting Electronics Industries (IPC)

ELECTRONICS INDUSTRY BIG WINNER AT IPC APEX EXPO 2014

Industry News | 2014-04-24 16:31:54.0

It was all business at IPC APEX EXPO® last month as 8,068 electronics manufacturing professionals from 47 countries converged at the Mandalay Bay Convention Center in Las Vegas.

Association Connecting Electronics Industries (IPC)

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Technical Library: gabriel (1)

Optimization of Stencil Apertures to Compensate for Scooping During Printing

Technical Library | 2018-03-07 22:41:05.0

This study investigates the scooping effect during solder paste printing as a function of aperture width, aperture length and squeegee pressure. The percent of the theoretical volume deposited depends on the PWB topography. A typical bimodal percent volume distribution is attributed to poor release apertures and large apertures, where scooping takes place, yielding percent volumes 100%. This printing experiment is done with a concomitant validation of the printing process using standard 3D Solder Paste Inspection (SPI) equipment.

Qual-Pro Corporation

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Express Newsletter: gabriel (1)

SMTnet Express - March 8, 2018

SMTnet Express, March 8, 2018, Subscribers: 31,288, Companies: 10,911, Users: 24,465 Optimization of Stencil Apertures to Compensate for Scooping During Printing Gabriel Briceno, Ph. D., Miguel Sepulveda; Qual-Pro Corporation This study

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