New SMT Equipment: george ball (1)

Allen-Bradley 1336F-BRF10-AA-EN  Adjustable Frequency AC Drive

Allen-Bradley 1336F-BRF10-AA-EN Adjustable Frequency AC Drive

New Equipment | Industrial Automation

Sales Manager: Sandy Lin Email:  unity@mvme.cn Skype:  onlywnn_1 Mobile(Whatsapp): (+86)-18020776786  XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD. is a company that professionally engaged in large system DCS spare parts supply. We supply DCS, PLC, MO

XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD.

Electronics Forum: george ball (13)

Solder Paste for Thermal Cycling application (-40 to 150 Degree Celcius)

Electronics Forum | Thu Dec 07 17:25:58 EST 2017 | davef

Help me understand your issue better ... Are you looking to: * Improve your products that are used for thermal cycling testing of products of other companies? * Change your production materials so that you pass thermal cycling testing of your produ

Re: voc free flux

Electronics Forum | Tue Mar 30 08:11:27 EST 1999 | George Steele

| | I require some feed back from any one who knows about using a voc free flux in a nitrogen wave solder machine soldering both through hle and smt componants. | | What disadvantages are there when using this flux? | | Do you have any contact detail

Industry News: george ball (21)

Technical Papers Take Top Honors at IPC APEX EXPO Winning Papers to be Presented at Technical Conference

Industry News | 2013-02-14 08:18:47.0

IPC – Association Connecting Electronics Industries® has announced the winners of the Best U.S. and International Papers of IPC APEX EXPO® 2013

Association Connecting Electronics Industries (IPC)

Electronics Industry Volunteers Honored for Contributions to Industry and IPC

Industry News | 2011-04-20 21:26:17.0

IPC — Association Connecting Electronics Industries® presented Special Recognition, Distinguished Committee Leadership and Committee Service awards and a Presidents Award at IPC APEX EXPO™, held April 10–14, in Las Vegas.

Association Connecting Electronics Industries (IPC)

Technical Library: george ball (1)

Characterization of Solder Defects on Package on Packages with AXI Systems for Inspection Quality Improvement

Technical Library | 2016-05-30 22:24:00.0

As a part of series of studies on X-Ray inspection technology to quantify solder defects in BGA balls, we have conducted inspection of 3 level POP package by using a new AXI that capable of 3D-CT imaging. The new results are compared with the results of earlier AXI measurements. It is found that 3D measurements offer better defect inspection quality, lower false call and escapes.

Flex (Flextronics International)

Express Newsletter: george ball (164)

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