Convection reflow oven for PCBs with 5 zones on top and five bottom vertical heating zones, the NEW GF-125 HC/HT is an economic solution for automatic medium volume production runs. Utilizing horizontal convection heating technology, the GF-125 HC/H
Click here to view the SlimKIC 2000 datasheet Profiling So Easy, Anyone Can Do It By automating the complex task of process set up the SlimKIC® 2000™ makes profiling so easy that any operator can quickly achieve the optimal process. Simply select fro
Electronics Forum | Mon Jul 24 09:38:28 EDT 2006 | nodlac
Addressing the issue "Will cutting change the readings?" Very Very Doubtful. Here is a link to a helpful guide. http://www.omega.com/techref/ Enjoy, cal
Electronics Forum | Thu Nov 01 16:41:13 EDT 2007 | slthomas
That might be the stuff. I think what baffles me is that it was readily available and packaged as "thermocouple attachment solder" or some such description, but they apparently don't seem to have it available by that name. It's not a critical issue,
Industry News | 2018-10-18 08:59:34.0
PRINCIPLE OF SURFACE MOUNT PROCESS(SMT PROCESS)
Industry News | 2017-09-28 15:07:29.0
Vision Engineering has teamed up with industry-expert Bob Willis to broadcast a free Electronics Academy Webinar aimed at identifying the issues affecting PCB/SMT assembly and the challenges of achieving Zero Defect Manufacture.
Parts & Supplies | Assembly Accessories
Detailed Product Description Features: 7 Channel Brand: KIC Part Name: X5 Reflow Profiler Model: X5 Condition: Original New Leadtime: 7days KIC X5 Thermal Profiler with SPC software and RF capability For Reflow Track More Data Points With 7,
Technical Library | 2009-12-14 20:24:19.0
In the lead-free era, thermal profiling has a critical role in the SMT assembly process. We discuss the profiling, tools, practical issues, and inspection methods of golden boards, and related tools. As the process window narrows, profiling equipment and/or thermocouple (TC) errors must be taken into consideration. In addition, the accuracy and attachment method of the thermocouple will significantly impact critical assemblies.
Career Center | binan city, Laguna Philippines | Engineering,Maintenance,Technical Support
6.5 Years Experience in Semiconductor Industry Specializing in Dispensing process and Equipment. 5.0 Years of Experience in Field Service Engineering. Machine Commissioning / Customer support 24 / 7, Technical Support for Customer machine and process
SMT Express, Issue No. 3 - from SMTnet.com Volume 1, Issue No. 3 Wednesday, August 18, 1999 Featured Article Return to Previous Page BGA REWORK Earl Moon Proof Of Design (POD) PRE OPERATIONAL REQUIREMENTS The following requirements shall
Evaluating The Accuracy Of a Nondestructive Thermocouple Attach Method For Area-Array Package Profiling Evaluating The Accuracy Of a Nondestructive Thermocouple Attach Method For Area-Array Package Profiling The oven recipe, which consists
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diviation equally on PCB to avoid any thermal shock to the components(fast temperature ramup will damage the comonents), when doing this, Pick and place machine also need the output capacity of the reflow oven is big, so nowadays the 10 heating zones reflow oven an 12 heating zones reflow oven become the widely used
GPD Global | https://www.gpd-global.com/co_website/pdf/doc/Embedded-IR-Heater-User-Guide-22140091.pdf
is returned to GPD Global by Buyer and found by GPD Global in its sole judgment to be defective, GPD Global will issue to Buyer a credit in the amount of the price of the replacement part. GPD Global’s acceptance of any parts so shipped to it shall not
