Industry Directory: go reflow 1.8 (7)

Datapaq, Inc.

Industry Directory | Manufacturer

Datapaq, founded in 1984, is the world leader in temperature profiling. Datapaq systems provide key information on the effectiveness of heat processing in the electronics assembly industry, using the most advanced and tested techniques.

Used SMT Brokers

Industry Directory | Marketing Agency

Used SMT & PCB assembly equipment Brokers, Free

New SMT Equipment: go reflow 1.8 (40)

HeatShieldGel™ - Thermal Protection of Electronic Components During Reflow

HeatShieldGel™ - Thermal Protection of Electronic Components During Reflow

New Equipment | Rework & Repair Equipment

BEST HeatShield Gel™ is a thermal shield water-based gel designed to be used in the PCB rework/repair or board assembly areas in order to provide thermal protection of electronic components. It is truly a revolutionary means to protect components. It

BEST Inc.

HeatShields™ Ceramic Thermal Shielding Material for PCB Rework

HeatShields™ Ceramic Thermal Shielding Material for PCB Rework

New Equipment | Rework & Repair Equipment

Protecting Heat Sensitive Components. Are you in need of a flexible method for shielding nearby components during the PCB rework process? Do you find yourself looking for an effective heat shielding product which can be easily modified to protect a

BEST Inc.

Electronics Forum: go reflow 1.8 (1324)

How many times can a component go through reflow oven?

Electronics Forum | Fri Aug 21 04:37:26 EDT 2009 | grahamcooper22

Manufacturers of non hermetic SMT components have to test their devices as per IPC JEDEC 20C to check their reflow and moisture sensitivity. In this spec they pass them through reflow 3 times, then check them for damage and retest their performance.

How many times can a component go through reflow oven?

Electronics Forum | Thu Sep 03 11:18:04 EDT 2009 | dyoungquist

We do not have any electrolytic capacitors on this board.

Used SMT Equipment: go reflow 1.8 (18)

SEHO GoReflow 1.8

Used SMT Equipment | Soldering - Reflow

Model: SEHO GO Reflow 1.8 Produced: 2015 Working flow Right to Left Actual status: Functional in production Date of release to sale: 2020 02

Salescon Ltd.

SEHO GoReflow 2.3

Used SMT Equipment | Soldering - Reflow

Seho reflow oven, GoReflow 2.3 GOR2.3

Salescon Ltd.

Industry News: go reflow 1.8 (140)

Fairchild Announces Industry's First SSOT-6 FLMP N-Channel MOSFETs

Industry News | 2003-05-22 08:36:27.0

Packaging Saves PCB Board Space Without Sacrificing Power Dissipation Capability

SMTnet

Online Equipment Auction Now Open

Industry News | 2022-06-13 13:10:34.0

Items Including – 2014 ACE KISS 102 Selective Solder, 2014 On-Site N25T Nitrogen Generator, 2014 RPS FRX16 Selective Solder, Vitronics XPM2-940 Reflow Oven, 2008 Aqueous SMT600-CL Batch Washer, 2005 DEK Horizon 03 Screen Printer, 2004 Heller 1088EXL Reflow Oven, [2] 2002 BTU Pyramax 98A Reflow Ovens, 2001 Scorpion FLS650 Flying Prober, Mydata TM Style Magazines, Mydata Agilis Magazines, Mydata Agilis Feeders, Mydata Tray Wagons, [2] Bliss Pallet Racks & much more...

Baja Bid

Parts & Supplies: go reflow 1.8 (10)

Fuji CP6 1.8MM NOZZLE

Fuji CP6 1.8MM NOZZLE

Parts & Supplies | Pick and Place/Feeders

BTW, we have sepcialzied in SMT field over 12 years and support one-stop SMT solution for our customers. Including SMT equipment and spare parts, such as Loader and Unloader, Reflow oven, Nozzle, feeder, motor, PCB board ect. We can also customize

Qinyi Electronics Co.,Ltd

Fuji Ahrg1350 FUJI Gl2 Gl5 Gl541 1.0 0.7 1d1s IC Needle

Fuji Ahrg1350 FUJI Gl2 Gl5 Gl541 1.0 0.7 1d1s IC Needle

Parts & Supplies | Assembly Accessories

FUJI Nozzle in stock FUJI CP3 / CP4 Bore diameter 0.7 / 1.0 / 1.3 FUJI CP6 / CP7 Bore diameter 0.7 / 1.0 / 1.3 / 1.8 FUJI CP6 / CP7 Bore diameter 2.5 / 3.7 / 5.0 FUJI XP141 / 142 Bore diameter 2.5 / 3.7 / 5.0 FUJI XP141 / 142 0.7 / 1.0 / 1.3 / 1

KingFei SMT Tech

Technical Library: go reflow 1.8 (3)

Going Lead Free With Vapor Phase Soldering - Lead Free Is Still a Challenge For Major Industries.

Technical Library | 2014-01-30 18:08:04.0

As of today, the electronic industry is aware of the requirements for their products to be lead free. All components are typically available in lead free quality. This comprises packages like BGAs with BGA solder balls to PCB board finishes like HASL. The suppliers are providing everything that is needed. It is harder to get the old tin leaded (SnPb) components for new applications today, than lead free ones. So why has not everybody changed over fully yet and how can the challenges be overcome? A big concern in this transition process is reflow soldering. The process temperatures for lead free applications became much higher. Related with this is more stress for all the components. It affects the quality and reliability of the electronic units and products...

IBL - Löttechnik GmbH

A High Thermal Conductive Solderable Adhesive

Technical Library | 2016-11-17 14:37:41.0

With increasing LED development and production, thermal issues are becoming more and more important for LED devices, particularly true for high power LED and also for other high power devices. In order to dissipate the heat from the device efficiently, Au80Sn20 alloy is being used in the industry now. However there are a few drawbacks for Au80Sn20 process: (1) higher soldering temperature, usually higher than 320°C; (2) low process yield; (3) too expensive. In order to overcome the shortcomings of Au80Sn20 process, YINCAE Advanced Materials, LLC has invented a new solderable adhesive – TM 230. Solderable adhesives are epoxy based silver adhesives. During the die attach reflow process, the solder material on silver can solder silver together, and die with pad together. After soldering, epoxy can encapsulate the soldered interface, so that the thermal conductivity can be as high as 58 W/mk. In comparison to Au80Sn20 reflow process, the solderable adhesive has the following advantages: (1) low process temperature – reflow peak temperature of 230°C; (2) high process yield – mass reflow process instead of thermal compression bonding process; (3) low cost ownership. In this paper we are going to present the die attach process of solderable adhesive and the reliability test. After 1000 h lighting of LED, it has been found that there is almost no decay in the light intensity by using solderable adhesive – TM 230.

YINCAE Advanced Materials, LLC.

Videos: go reflow 1.8 (57)

Fuji CP6 1.8MM NOZZLE

Videos

BTW, we have sepcialzied in SMT field over 12 years and support one-stop SMT solution for our customers. Including SMT equipment and spare parts, such as Loader and Unloader, Reflow oven, Nozzle, feeder, motor, PCB board ect. We can also customize

Qinyi Electronics Co.,Ltd

SMT Barcode Inkjet Printer

SMT Barcode Inkjet Printer

Videos

SMT Barcode Inkjet Printer ETA-410 If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. smt barcode Inkjet Printing Machine,pcb barcode printing

Dongguan Intercontinental Technology Co., Ltd.

Events Calendar: go reflow 1.8 (2)

Empire Chapter Webinar: LIVE Action Reflow Focused Process

Events Calendar | Wed Jun 22 00:00:00 EDT 2022 - Wed Jun 22 00:00:00 EDT 2022 | ,

Empire Chapter Webinar: LIVE Action Reflow Focused Process

Surface Mount Technology Association (SMTA)

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Association Connecting Electronics Industries (IPC)

Career Center - Jobs: go reflow 1.8 (2)

Surface Mount Technician

Career Center | Chesterfield, Derbyshire, United Kingdom | Engineering,Maintenance,Quality Control

We are currently recruiting for Surface mount Technicians for our client, based in a town called Clay Cross, which is close to Chesterfield in Derbyshire. The main purpose of the role is the programming and operating of surface mount equipment to

Drake International

Sr. SMT Process Engineer

Career Center | San Jose, San Diego, Dallas, NH, NC USA | Engineering,Research and Development

Global Senior SMT Equipment Engineer urgently needed. If you can stomach the extra long title for this position.....keep reading and prepare yourself for one of the best career opportunities available today within the Contract Electronics Manufacturi

Gilbert Consulting Services

Career Center - Resumes: go reflow 1.8 (6)

rozenblit1

Career Center | , Israel | Engineering,Maintenance,Technical Support

I was born on June , 1972 in Khmelnitsky city , Ukraine . I am male. From 1979 to 1987 I was studying at secondary school #7, having finished which I entered the Technical College of Khmelnitsky in specialty Machine Tools with Computer Numeric Contr

TECHNICIAN

Career Center | THRISSUR, India | Maintenance,Production

HANDLING OF MAINTENANCE Camelot,Mascot, Selective Soldering,Wave Soldering,Aquastorm 200,H-500 HI-Z,Kolb,kerry&PBT,GETECH, ATI 105 & Final Touch 101,Heller,Btu&vapour phase,Shuttle,SRT,ESD ,Electrical maintenance . Knowledge in using SLIM KIC 2000&

Express Newsletter: go reflow 1.8 (959)

Partner Websites: go reflow 1.8 (12927)

ADNPN8253 FUJI XP142 XP143 1.8 SMT Nozzles

| https://www.feedersupplier.com/sale-13119001-adnpn8253-fuji-xp142-xp143-1-8-smt-nozzles.html

ADNPN8253 FUJI XP142 XP143 1.8 SMT Nozzles Leave a Message We will call you back soon! Your message must be between 20-3,000 characters

How to Choose Reflow Oven-Company News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com/cc?ID=te_news_media,10561&url=_print

How to Choose Reflow Oven-Company News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin Reflow oven,SMT Reflow Soldering Oven 当前位置: Home >> News >> Company News How to Choose Reflow Oven How to Choose Reflow Oven As the precision of electronic products puts new demands on the reflow process, a general trend is to require reflow soldering to


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