Chip assembly? Classic SMT placement? Our SIPLACE CA can do both. The SIPLACE CA is the world's first placement platform that combines bare-die placement directly from the wafer and classic SMT placement in a single machine and a single production
Electronics Forum | Sun Jul 25 08:54:37 EDT 1999 | Tom Gervascio
| We are having a process related problem with pullup resistors on a controller card which has a I960 micro-processor. | The controller monitors signal inputs and it's own resources then blinks a LED to indicate its working. The problem is that after
Electronics Forum | Mon Jul 26 14:14:51 EDT 1999 | Steve Gregory
| | | We are having a process related problem with pullup resistors on a controller card which has a I960 micro-processor. | | | The controller monitors signal inputs and it's own resources then blinks a LED to indicate its working. The problem is th
Industry News | 2020-07-14 16:02:22.0
Indium Corporation's Dr. Ning-Cheng Lee, Vice President of Technology, co-authored Assembly and Reliability of Lead-Free Solder Joints with Dr. John H. Lau. The book is a new source on lead-free solder joints for advanced reliability across the complete food chain of electronics products.
Industry News | 2019-09-20 08:45:31.0
09.19.2019 – Boca Raton – “Having worked in the electronics manufacturing industry since graduating from University of Maryland in 1980 with a BSEE, it’s truly puzzling to me that sophisticated machines capturing so much data have not been used to their full potential”, says Frank Mascetti, Owner of Technical Resources Corporation (TRC). For decades, he has witnessed this with respect to semiconductor test systems to In-Circuit Test to assembly and inspection machines alike. When he transitioned from electrical engineering into his sales profession many years ago, he listened to “spinmeisters” who worked very hard on creating a story with sales collateral. The companies acted like “it’s simply magic” and we can “plug all these boxes into one another.” In short, “Industry 4.0 will solve everything.”
Technical Library | 2015-06-30 22:02:41.0
This paper describes the losses from defects at the placement process in the SMT line. Two case studies of European and Taiwanese SMT manufacturers illustrate the actual losses from their defects. An evaluation method to select a pre-reflow AOI system maximizing the return on investment (ROI) is introduced. In the end, ROIs of three commercial pre-reflow AOI systems are compared to demonstrate the importance of selecting an appropriate AOI system. This paper will increase the probability that anyone installing an AOI system during the pre-reflow process will obtain a successful gain with short payback period.
https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_conveyor/100.html PCB linking conveyor and PCB belt conveyor mainly used to connect different type PCB board handing equipment effectively for the SMT production line. ASCEN technology is ava
https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_conveyor/100.html PCB linking conveyor and PCB belt conveyor mainly used to connect different type PCB board handing equipment effectively for the SMT production line. ASCEN technology is ava
Screen and Stencil Printing Processes for Wafer Backside Coating News Forums SMT Equipment Company Directory Calendar Career Center Advertising About FREE Company Listing! Screen and Stencil Printing Processes for Wafer Backside
INSERT INTO tracking_express (userid, username, page_id, ts) VALUES ('#Quser_profile.id#', '#Quser_profile.username#', 14, (#ts#)) SMT Express, Volume 2, Issue No. 4 - from SMTnet.com Volume 2, Issue No. 4 Wednesday, April 19, 2000
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Intermetallic Growth on PCB-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin Reflow oven,SMT Reflow Soldering Oven 当前位置: Home >> News >> News Intermetallic Growth on PCB Intermetallic Growth on PCB Where the tin-lead solder adheres to the copper of the lead
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