Fine Line Stencil’s new UltraSlic™ FG solder paste stencil is the latest breakthrough in stencil technology. With superior paste release below surface area ratios of 0.5, UltraSlic™ FG outperforms all other existing stencil technologies on the market
Electronics Forum | Wed Oct 12 13:44:10 EDT 2016 | dekhead
Yes, bottom-side fids are usually half-etched with epoxy fill. just the half-etch gives a pretty "dirty" looking fid.
Electronics Forum | Wed Oct 12 11:02:59 EDT 2016 | hken
I think stencil manufacturers back fill half etched fiducials with black epoxy or something. I know I've had some worn and that's what I've done for my vision systems to be happy again.
Industry News | 2017-05-16 17:59:37.0
PCB Technology Trends 2016, a global study published this month by IPC – Association Connecting Electronics Industries®, is now available. The survey-based study shows how printed circuit board (PCB) manufacturers are meeting today’s technology demands and looks at the changes expected by 2021 that will affect the whole industry.
Industry News | 2013-06-20 19:24:42.0
IPC – Association Connecting Electronics Industries® has released the agenda for IPC Conference on Component Technology: Closing the Gap in the Chip to PCB Process, an event designed to help the PCB supply chain and chip manufacturers better meet industry demands for reliability and performance.
