Industry News | 2009-04-09 22:35:29.0
The current economic climate, though challenging, certainly hasn't deterred the technology specialists at Henkel from continuing on an aggressive R&D path. As evidenced by an impressive five award wins during last week's APEX show in Las Vegas, Nevada, Henkel's commitment to innovation and materials advance is stronger than ever.
Industry News | 2009-05-26 18:16:29.0
In a remarkable breakthrough for underfill materials development, Henkel has engineered and launched a new underfill system that delivers on an unprecedented array of complex and demanding requirements, including room temperature fast flow, low temperature cure and reworkability. The new material, Hysol� UF3800�, has been specifically designed for use with today's CSP and BGA devices and is particularly well-suited for handheld communication and entertainment applications.
A Review of Test Methods and Classifications for Halogen-Free Soldering Materials A Review of Test Methods and Classifications for Halogen-Free Soldering Materials Over the last few years, there has been an increase in the evaluation and use
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/blog/102821-jetting-system-and-spray-valves-work-in-harmony-to-protect-led-headlights-from-icing
led to new and interesting challenges for manufacturers. Today, most new vehicles have switched from halogen headlights to LED for better energy and lighting efficiency
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/top-10-smt-new-product-stories-of-2014_topic1520_post6150.html
: NC520 is a no clean, halogen-free solder paste designed for the most demanding high-density electronic assemblies. It offers excellent wetting, improved printing, and reduces voiding
