Industry Directory | Consultant / Service Provider / Manufacturer
Manufacturer of the range of Fume Extraction & Purification Systems. These systems are designed to extract and purify fumes from laser processes, hand tool soldering and SMT equipment etc.
New Equipment | ESD Control Supplies
This static dissipative hand lotion is formulated specifically for use in and around static sensitive electronic and cleanroom areas. The hand lotion contains no parabens, fragrances, or dyes and will not affect solderability or cause corrosion. Ava
New Equipment | Education/Training
All Bob Willis training workshops are run on site at your manufacturing facility, conference or exhibition venues Worldwide. We offer the largest range of theory and hands on workshops in the industry. The content of any workshop may be modified to s
Electronics Forum | Mon Feb 13 10:41:14 EST 2017 | dyoungquist
Could be that your temperature ramp up rate is too fast. This could cause the flux in the solder paste to burn off too rapidly. When that happens, it can expand as it heats up and burns off, causing the solder to get spread out from the pad.
Electronics Forum | Sun Feb 12 22:52:20 EST 2017 | ltchsze
Hi fellow professionals, Wondering whether anyone has experience with solder splashing from component terminal. Have identified the source using the component without printing solder paste on PCB. Wondering the root-cause of the solder splashing fr
Used SMT Equipment | Soldering - Reflow
2009 Vitronics XPM2 Reflow Oven has Left to Right. 8 heating zones and 2 cooling zones. Only in use 6 months. 208V, 3 Phase, 60 Hz. System: * 8 top and bottom forced convection heat cells and 2 top and bottom cooling cells * Overall syst
Industry News | 2003-06-10 08:16:44.0
The following text describes the application of NWA Quality Analyst to quality control in the assembly of electronic components.
Industry News | 2018-10-18 09:27:40.0
Time Temperature setting wave soldering is the most important in the solder melts
Technical Library | 2023-04-17 17:05:47.0
In an ideal world, manufacturing devices would work all of the time, however, every company receives customer returns for a variety of reasons. If these returned parts contributed to a fail, most companies will perform failure analysis (FA) on the returned parts to determine the root cause of the failure. Failure can occur for a multitude of reasons, for example: wear out, fatigue, design issues, manufacturing flaw or defect. This information is then used to improve the overall quality of the product and prevent reoccurrence. If no defect is found, it is possible that in fact the product has no defect. On the other hand, the defect could be elusive and the FA techniques insufficient to detect said deficiency. No-clean flux residues can cause intermittent or elusive, hard to find defects. In an attempt to understand the effects of no-clean flux residues from the secondary soldering and cleaning processes, a matrix of varying process and cleaning operation was investigated. Of special interest, traveling flux residues and entrapped residues were examined, as well as localized and batch cleaning processes. Various techniques were employed to test the remaining residues in order to assess their propensity to cause a latent failure. These techniques include Surface Insulation Resistance1 (SIR) testing at 40⁰C/90% RH, 5 VDC bias along with C32 testing and Ion Exchange Chromatography (IC). These techniques facilitate the assessment of the capillary effect the tight spacing these component structures have when flux residues are present. It is expected that dendritic shorting and measurable current leakage will occur, indicating a failing SIR test. However, since the residue resides under the discrete components, there will be no visual evidence of dendritic growth or metal migration.
Dinghua Technology-- the leading manufacturer of BGA rework station, Automatic screw locking machine, Automatic soldering station and non-standard equipment. For more details, please just contact John, WhatsApp/Wechat:+86 1576811 4827 , Skype: si
Bob Willis "How to Do It" video clip explains how to test BGA or Area Array Packages for solderability. The reason this is difficult to do by other means is the solder terminations would be displaced during solder contact. A simple test like this als
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Tue Feb 19 00:00:00 EST 2019 - Tue Feb 19 00:00:00 EST 2019 | Elkridge, Maryland USA
SMTA Capital Chapter: Non-Destructive BGA/Area Array Component Rework
Career Center | Melbourne, Florida USA | Production
The SMD Repair / Operator performs all hand loading/unloading/operation of SMD line, manual soldering of Through-hole parts, inspection of PCBA's, and rework as required to support SMD production. Responsibilities: - Assists with manually load
Career Center | Tustin, California USA | Engineering
REI is seeking a bi-lingual (English/Japanese) surface mount technology (SMT) Manufacturing Engineer with printed circuit board (PCB) design and manufacturing experience to join our California Operations Group. The SMT Manufacturing Engineer will de
Career Center | Kitchener, Ontario Canada | Engineering,Maintenance,Technical Support
Knowledgeable in Design of Experiments (DOE), Design for Manufacturability (DFM), Statistical Process Control (SPC), Failure Mode & Effects Analysis (FMEA) and Root Cause Analysis that drives continuous improvement in package reliability. A recogniz
Career Center | Derabassi, India | Maintenance,Management,Production,Quality Control,Sales/Marketing
PCB Assembly (SMT & PTH)--Process/Planning – Production – Maintenance/Troubleshooting – QA/QC
| https://pcbasupplies.com/alloy-solder-paste-enig/
High Reliability Alloy Solder Paste For ENIG - PCBASupplies Login Create Account Contact View My Cart Menu × Categories Hand Soldering
| https://www.eptac.com/blog/leaded-vs-lead-free-solder-which-is-better?hsLang=en
. However, the amount of lead on solders is too insignificant to cause severe health problems. Which Solder is Better? Leaded solder is easier to use, has a lower melting point, is low cost, and causes fewer quality problems with the joints than lead-free solder, however