Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
: A total of 21 of 40 test vehicles had a void greater than 45% of solder ball diameter or 20% of ball area Solder crack path typically found at solder joint / BGA package interface Via in Pad (VIP
| Sm | t | net |
| 1 |
