Industry Directory | Consultant / Service Provider / Distributor / Manufacturer / Other
Ludee Circuits offer RoHS PCB.We could offer leadfree HASL,Entek, flash gold, immersion gold, immersion silver, immersion tin finishing based on standard FR-4, CEM-3 materials, Teflon, Rogers RO4000 series, as well as high Tg S1170 materials.
Industry Directory | Manufacturer
Professional, Reliable,High Quality,Low Cost, Rapid Delivery PCB manufacturer
We supply bare printed circuit boards provided to us by our offshore manufacturing partners. Our partners have been fully researched and carefully selected, and are ISO certified and UL-approved. Single-Sided board Double-sided board Multilayer
New Equipment | Solder Materials
Solder Wire from the Indium Corporation is made to demanding quality standards. Our flexible manufacturing process allows us to fulfill orders from evaluation/research quantities to full scale production volumes. Indium Solder Wire Diameters We m
Electronics Forum | Fri May 03 16:06:44 EDT 2013 | hegemon
To be short, no change in profile is going to get you through this. As I recall the point of hard gold is to retard the wetting process, so no surprise here. For example a connector might have hard gold plating at the mating surface, but not at t
Electronics Forum | Mon Jun 12 07:42:56 EDT 2006 | brian.perry@suntroncorp.com
We are placing a gold plated device (LCC) to a NiAu PCB using a SnPb No-clean solder. We're noticing quite a bit of difficulty with reliable joints (intermittent connectivity) and if we have to rework a particular device, adjacent devices of this sa
Industry News | 2013-10-28 16:31:54.0
IPC Conference on Solder and Reliability: Materials, Processes and Tests, November 13–14 in Costa Mesa, Calif.
Industry News | 2011-08-08 16:05:12.0
IPC will begin development of a data exchange standard to help the electronics manufacturing industry comply with forthcoming U.S. Securities and Exchange Commission (SEC) regulations on conflict minerals at a kickoff meeting on September 22, 2011, held in conjunction with IPC Midwest Conference & Exhibition, Schaumburg, IL.
Technical Library | 2023-08-04 15:27:30.0
A designed experiment evaluated the influence of several variables on appearance and strength of Pb-free solder joints. Components, with leads finished with nickel-palladium-gold (NiPdAu), were used from Texas Instruments (TI) and two other integrated circuit suppliers. Pb-free solder paste used was tin-silver-copper (SnAgCu) alloy. Variables were printed wiring board (PWB) pad size/stencil aperture (the pad finish was consistent; electrolysis Ni/immersion Au), reflow atmosphere, reflow temperature, Pd thickness in the NiPdAu finish, and thermal aging. Height of solder wetting to component lead sides was measured for both ceramic plate and PWB soldering. A third response was solder joint strength; a "lead pull" test determined the maximum force needed to pull the component lead from the PWB. This paper presents a statistical analysis of the designed experiment. Reflow atmosphere and pad size/stencil aperture have the greatest contribution to the height of lead side wetting. Reflow temperature, palladium thickness, and preconditioning had very little impact on side-wetting height. For lead pull, variance in the data was relatively small and the factors tested had little impact.
Technical Library | 2020-10-27 02:07:31.0
For companies that choose to take the Pb-free exemption under the European Union's RoHS Directive and continue to manufacture tin-lead (Sn-Pb) electronic products, there is a growing concern about the lack of Sn-Pb ball grid array (BGA) components. Many companies are compelled to use the Pb-free Sn-Ag-Cu (SAC) BGA components in a Sn-Pb process, for which the assembly process and solder joint reliability have not yet been fully characterized. A careful experimental investigation was undertaken to evaluate the reliability of solder joints of SAC BGA components formed using Sn-Pb solder paste. This evaluation specifically looked at the impact of package size, solder ball volume, printed circuit board (PCB) surface finish, time above liquidus and peak temperature on reliability. Four different BGA package sizes (ranging from 8 to 45 mm2) were selected with ball-to-ball pitch size ranging from 0.5mm to 1.27mm. Two different PCB finishes were used: electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) on copper. Four different profiles were developed with the maximum peak temperatures of 210oC and 215oC and time above liquidus ranging from 60 to 120 seconds using Sn-Pb paste. One profile was generated for a lead-free control. A total of 60 boards were assembled. Some of the boards were subjected to an as assembled analysis while others were subjected to an accelerated thermal cycling (ATC) test in the temperature range of -40oC to 125oC for a maximum of 3500 cycles in accordance with IPC 9701A standard. Weibull plots were created and failure analysis performed. Analysis of as-assembled solder joints revealed that for a time above liquidus of 120 seconds and below, the degree of mixing between the BGA SAC ball alloy and the Sn-Pb solder paste was less than 100 percent for packages with a ball pitch of 0.8mm or greater. Depending on package size, the peak reflow temperature was observed to have a significant impact on the solder joint microstructural homogeneity. The influence of reflow process parameters on solder joint reliability was clearly manifested in the Weibull plots. This paper provides a discussion of the impact of various profiles' characteristics on the extent of mixing between SAC and Sn-Pb solder alloys and the associated thermal cyclic fatigue performance.
At present, the low-power laser and the medium-power laser are gradually being localized, while the superpower lasers are just beginning to be localized and is accelerating. How to improve the reliability of superpower lasers welding is an urgent tec
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
SMT Express, Volume 5, Issue No. 8 - from SMTnet.com Equipment Impacts of Lead Free Wave Soldering The popular tin (Sn) rich lead free solders are causing severe corrosion to many of the materials used in today�s Wave Solder systems
Voiding Control for QFN Assembly Voiding Control for QFN Assembly Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry nowadays. This package offers a number of benefits including (1) small size
Imagineering, Inc. | https://www.pcbnet.com/blog/everything-you-need-to-know-about-pcb-finish/
. Per their requirements, any substances containing lead must have a concentration below 1000 parts per million to maintain compliance with these rules
| https://www.smtfactory.com/pcb-x-ray-inspection-machine
. They feature a one-key measurement system for bubble size, void rate, and tin climbing height. 360-Degree Platform Rotation 1. The platform's ability to rotate a full 360 degrees ensures comprehensive inspection coverage. 2
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