Industry Directory | Manufacturer
Hitechpcba is a wоrld-lеаding PCB Manufacturing & PCB Assembly company with more than 20 years experience in the electronics manufacturing industry. We focus on Circuit board fabrication, PCB assembly, electronic parts sourcing.
Welcome to the next generation in PWB test solutions. We combine an exceptional team of technology and applications experts with HIOKI's industry-leading systems to enhance your reliability and to speed up your product development process.
New Equipment | Education/Training
The Electronics Industry’s Source of Data and Insights for Smart Business Decisions. The IPC Technology Market Research Council offers members unique and customized research for the electronics assembly industry. Network with industry leaders at ex
New Equipment | Fabrication Services
PCB manufacturer---Hitech Circuits Co., Limited is a PCB manufacturer from China and we focus on multilayer printed circuit board; High density PCB /HDI, hard gold board; Flexible board / FPCB; Bergquist Aluminum based board, Aluminium PCB, Aluminum
Electronics Forum | Wed Aug 02 23:28:44 EDT 2017 | dawson
there are many ideal pcb manufacturers can reach your requirements. multi-layer and hdi boards, you can try and test http://www.madpcb.com
Electronics Forum | Tue Jun 16 05:03:01 EDT 2015 | hampoo_ems
Hi, Hampoo Electronics provides high quality HDI pcb board. If in need, plz feel free to email to contact@hampoo.com.
Industry News | 2003-02-25 08:18:29.0
Teradyne can now provide deep micro-via technology for customers of high-performance printed circuits.
Industry News | 2003-02-17 08:21:41.0
HDI Sales Made Up Larger Share of Net Sales in 4Q
Parts & Supplies | Circuit Board Assembly Products
1). 1+C+1 HDI, buried/blind L1-L5/L5-L8 vias. 2). FR-4 Material, 1 oz weight. 3). 8 layer, 1.6mm thick. 4). 4/4 mils track and space 5). Min.drill 0.1mm 6). Green solder mask/ white silkscreen 7). Immersion gold over nickel
Technical Library | 2008-04-15 14:43:08.0
The increasing demands for miniaturization and better functionality of electronic components and devices have a significant effect on the requirements facing the printed circuit board (PCB) industry. PCB manufactures are driving for producing high density interconnect (HDI) boards at significantly reduced cost and reduced implementation time. The interconnection complexity of the PCB is still growing and today calls for 50/50 μm or 25/25 μm technology are real. Existing technologies are unable to offer acceptable solution. Recently the Laser Direct Imaging (LDI) technology is considered as an answer for these challenges.
Unipress - Institute of High Pressure Physics of the Polish Academy of Sciences
Technical Library | 2021-12-21 23:21:34.0
Points of discussion in "HDI Microvia Technology – Cost Aspects" are: - Reasons for the use of HDI technology - Printed circuit board (PCB) size - Number of layers - Stack-up and complexity - Other important cost influences -–Design rules -–Drilling costs -–Microvia filling
The Electronics Industry’s Source of Data and Insights for Smart Business Decisions. The IPC Technology Market Research Council offers members unique and customized research for the electronics assembly industry. Network with industry leaders at ex
With the development of miniaturization of assembly components, the layout area and pattern design area of PCBs have also been continuously reduced, and PCB manufacturers are constantly updating the production process to conform to the development tr
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Events Calendar | Tue Dec 04 00:00:00 EST 2018 - Tue Dec 04 00:00:00 EST 2018 | ,
Qualification and Reliability of Microvias
Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support
• Highly motivated, solution oriented professional with proven record synergizing scientific, engineering, and business administration backgrounds to drive and sustain customer satisfaction and long term improvements. • Articulate communicator that a
| https://www.eptac.com/wp-content/uploads/eptac/datasheets/EPTAC_DataSheet_IPCDesigner_CID-Plus.pdf
• HDI - Interconnect Vias Types and Strategies DAY 2 ELECTRICAL PARAMETERS • Physical Board Dielectric Parameters • Shielding Techniques to Prevent Signal Emission
| https://ipcapexexpo.org/ipc-apex-expo-2021-professional-development-courses
: Mark McMeen and Mike Bixenman, Magnalytix PD26: Troubleshooting and Process Optimization - Lessons Learned from the Trenches and a Decade of Board Talk - Part I Phil Zarrow & Jim Hall