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We are a global electronics manufacturing Solutions provider ....Our company supplies new and used SMT equipment, spare parts, consumibles, ESD supplies and services to a wide range of EMS companies.
ProntoSELECTIVE-SOLDERING is used by electronic manufacturers to quickly program their Selective Soldering machines. ProntoSELECTIVE-SOLDERING helps program most popular Selective Soldering machines such as ACE Production Technologies, RPS Autom
JUKI LX-8 Pick and Place Machine Applicable Components: 0201Board size:410×400mmFeeder inputs:136placement capacity:105,000CPHProduct description: JUKI LX-8 Pick and Place Machine,Applicable Components: 0201,Board size:410×400mm,placement capacity:1
Electronics Forum | Thu Feb 15 00:09:59 EST 2024 | erici
Does anybody know how to disable the RV head on a Siplace F5 machine. Our machine is configured with a 6-head RV head and an IC head. We are having problems with the RV head, and machine wont initialise without finishing the RV head reference run.
Electronics Forum | Tue Oct 21 04:45:13 EDT 2008 | stanyserrao
Head 1 is not placing the parts in production. Same component is placed by head 2. Head 1 camera is camera 12 type and head 2 camera is type 8. Machine re-set done resent proper data and interchanged cameara still same problem was foundd in head 1.
Used SMT Equipment | Pick and Place/Feeders
This equipment is located in our upcoming STS Online Auction - February 25 - 28, 2019 S/W: 2.8.2b T5 Y Wagon Midas Head Hydra Head Agilis Compatible 14 Magazine Slots Large Tray Wagon Serial: 19120
Used SMT Equipment | Pick and Place/Feeders
Features: 12 nozzle star head Single placement head 2x feeder trolleys Windows 7 O/S
Industry News | 2009-02-02 18:48:47.0
Henkel today announced the appointment of Mr. Luc Godefroid as the company's Global Sales Director for its Semiconductor Group. A key member of Henkel's electronics sales team since 2001, Godefroid's new role sees him building on his previous success and directing the global sales efforts of Henkel's worldwide team and expanded product portfolio.
Industry News | 2003-06-19 08:13:11.0
The new heads are capable of reaching an acceleration of greater than 20g.
Parts & Supplies | General Purpose Equipment
The new inspection mirror meets clean room requirements yet is sufficiently economical for non-clean room applications. A quality tool for the technician but inexpensive enough to meet the budgetary requirement of modern manufacturing. /8" Mirror He
Parts & Supplies | SMT Equipment
Universal Lightning head ( 49560803 )
Technical Library | 2013-12-27 10:39:21.0
The head-in-pillow defect has become a relatively common failure mode in the industry since the implementation of Pb-free technologies, generating much concern. A head-in-pillow defect is the incomplete wetting of the entire solder joint of a Ball-Grid Array (BGA), Chip-Scale Package (CSP), or even a Package-On-Package (PoP) and is characterized as a process anomaly, where the solder paste and BGA ball both reflow but do not coalesce. When looking at a cross-section, it actually looks like a head has pressed into a soft pillow. There are two main sources of head-in-pillow defects: poor wetting and PWB or package warpage. Poor wetting can result from a variety of sources, such as solder ball oxidation, an inappropriate thermal reflow profile or poor fluxing action. This paper addresses the three sources or contributing issues (supply, process & material) of the head-in-pillow defects. It will thoroughly review these three issues and how they relate to result in head-in pillow defects. In addition, a head-in-pillow elimination plan will be presented with real life examples will be to illustrate these head-in-pillow solutions.
Technical Library | 1999-04-26 11:52:34.0
An evaluation of two fluxers, one with a reciprocating ultrasonic head and the other with microjets, was performed using nine independent criteria. The paper describes the methods of testing and the results.
Events Calendar | Wed Mar 03 00:00:00 EST 2021 - Wed Mar 03 00:00:00 EST 2021 | ,
Are Humidity Indicators Part of Your Supply Network?
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Career Center | Kochchikade, Sri Lanka | Management,Production,Quality Control
We are a Swiss EMS company ISO 9000 / 14001 certified situated in Sri Lanka since 1988 with a staff count of 650 employees. Currently we go trough a major upgrade of our Facilities and Technology. Following positions need to be filled: 1 x Head of
Career Center | , California USA | Engineering,Sales/Marketing
My client, is taking their Electronics Manufacturing Services (EMS) business to the next level. They have an urgent need for a National Director of Business Development, to head up the sales of new and existing business. This is the opportunity to
Career Center | Pusing, Malaysia | Engineering
I am interested to be a part of the organization where I can fully utilize my skills and make a significant contribution to the success of the employer and at the same time my individual growth. It is also another precious opportunity for me to explo
Career Center | Pusing, Malaysia | Engineering
I am interested to be a part of the organization where I can fully utilize my skills and make a significant contribution to the success of the employer and at the same time my individual growth. It is also another precious opportunity for me to explo
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