Industry Directory | Consultant / Service Provider / Manufacturer
PennEngineering Fastening Technologies� serves as a single source for fastening solutions, offering the hardware, equipment, and technical services and support to satisfy assembly needs from design through production.
Industry Directory | Manufacturer / Media / Publisher / Online Resource / Training Provider
Endodontic NiTi File Manufacturing Machine Supply || Grinder || Assembly || Heat-treatment Your Gateway to Endo Niti File Manufacturing Excellence!
The ICI FX-160 is a rugged, portable, thermal imager; built to withstand extreme environments with a rating of IP 67. It has a drop test rating of 5.9 feet. Its one handed operation makes it simple and easy to use. The large 3.5” LCD display produces
DC-Generatoren Advanced Energy MDX-L6 - P/N 3152317-000 MDX-L12 - P/N 3152313-000 MDX-L12-650 - P/N 3152313-003 MDX-L12M - P/N 3152313-001 MDX-L12M-650 - P/N 3152344-101 MDX-L15 - P/N 3152354-000 MDX-L18M - P/N 3152345-100 MDX-20K Master -
Electronics Forum | Sat Nov 04 22:26:33 EST 2000 | Aoki Laboratories Ltd.
Greg, The operating parameters for Wave Soldering are: 1. Preheat Temp. (80-110 c, board surface); 2. 1.5-3 secs dwell time in solder. This, 1.5 second, is the time required for both the lead and solder to gain sufficient heat and as a result "tinn
Electronics Forum | Tue May 10 17:50:08 EDT 2005 | davef
Consider: * Changing your temporary solder resist [TSR] to a light cure. * Contracting with your board fabricator to apply the TSR. * Gaining better thickness control of your application process by silk screening the current TSR. * Forcing more air c
Industry News | 2023-06-12 21:14:11.0
The 2023 Beijing Intelligent Manufacturing and SMT Technology Exchange Conference, hosted by the Intelligent Manufacturing Committee of the Beijing Electronics Society, was successfully held in Beijing on May 25th. HELLER was honored to be invited and actively participated by sharing their cutting-edge technology and expertise.
Industry News | 2015-06-11 16:02:18.0
MIRTEC, "The Global Leader in Inspection Technology," will exhibit its most recent solutions for System in Package (SiP) inspection and measurement at SEMICON WEST 2015; July 14-16, 2015, at the Moscone Center in San Francisco, CA. Visitors are invited to booth # 2343 for a detailed demonstration of this exciting new technology.
Technical Library | 2019-05-01 10:07:37.0
Adhesive bonding involves the use of adhesive to form a material bond between two or more assembly parts. In addition to regular adhesive bonding applications, hybrid processes, in which the adhesive bond includes another function such as sealing or heat dissipation, are gaining importance. Traditional joining methods such as welding or bolting are progressively being replaced in industrial applications by efficient adhesive bonding processes, since these processes provide a number of advantages such as part weight reduction or simplified parts handling.
Technical Library | 2021-11-26 14:34:07.0
The use of desiccant bags filled with Silica Sand and or Clay beads used in conjunction with a Moisture Barrier Bag to control moisture for storage of printed circuit boards has long been an accepted practice and standard from both JEDEC and IPC organizations. Additionally, the use heated ovens for baking off moisture using the evaporation process has also been a long#2;standing practice from these organizations. This paper on alternative drying methods will be accompanied by completed independent, unbiased tests conducted by Vinny Nguyen, an engineering student (now graduated) from San Jose State University. The accompanied paper will examine the performance levels of different technologies of desiccant bags to control moisture in enclosed spaces. The tests and equipment set were reviewed by an engineer and consultant to the Lockheed Martin Aerospace Division and the IPC - TM-650 2.6.28 test method was review by engineer from pSemi. The tests were designed to mimic performance tests outlined in Mil Spec 3464, which both IPC and JEDEC have adopted for their respective standards. The test examined variables including absorption capacity rates, weight gain and release of moisture back into the enclosed area. The presentation will also address and highlight: • Similarities of PCBs and Heavy Equipment as it applies to Inspections, Causes of Failure, Types of Corrosion and Moisture Collection Points. • Performance Attributes of Different Desiccant Technologies as it applies to shape, texture, change outs, labeling and regeneration. • Venn Diagram of Electromechanical Failure with the circles 1. Current 2. Contamination 3. Humidity Presentation Available
Career Center | Murphy, North Carolina USA | Engineering
We are seeking a qualified and experienced senior design engineer to join our team. The best candidate will use both mechanical and electrical engineering skills to design innovative power supplies that are highly efficient, rugged, and have high rel
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/adhesive-dispensing-systems/products/nozzles/universal-summit-nozzles
. Nozzles are compatible with all Nordson Universal modules and Universal applicators . Gain high bond strength at low add-on rates in continuous and intermittent operations
