Industry Directory | Consultant / Service Provider / Distributor / Equipment Dealer / Broker / Auctions / Manufacturer / Manufacturer's Representative
DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD is a company which mainly provide used and new SMT parts, provide repair SMT key parts service,new/used SMT machine trading,SMT consumables and Peripherals equipment,Clean room, ESD..
Industry Directory | Manufacturer
DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD is a company which mainly provide used and new SMT parts, provide repair SMT key parts service,new/used SMT machine trading,SMT consumables and Peripherals equipment,Clean room, ESD..
The World's Best Convection Reflow Oven The ultimate high volume production reflow oven with belt speeds up to 1.4 m/min to accommodate the fastest pick and place systems. Lead Free Certified reflow oven! Maintenance Free! Lowest Nitrogen &
The World's Best SMT Convection Reflow Ovens for Large Boards and Dual Lane 1826 Mark 5 reflow oven provides consistent performance for high volume reflow requirements while minimizing preventative maintenance and floorspace. Lead Free Certified!
Electronics Forum | Wed Dec 17 08:49:04 EST 2003 | patrickbruneel
Kev, It looks like you have a preheating powerplant and you still only get the board up to 85 Deg. This indicates that the preheating is out of calibration or the range settings might be very wide (Fex the preheat elements shut down at 500 and go ba
Electronics Forum | Sun Jun 10 12:30:10 EDT 2001 | procon
Is this a Convection Oven or IR? If convection, you can increase the air velocity in the zones if the oven has this ability. You should do as Dave has explained. If you must use pallets when reflowing your components, you need to profile in the same
Used SMT Equipment | Soldering - Reflow
1996 Vitronics Unitherm 520A Reflow Oven Features: 5 Heat Zones Top and Bottom / 2 Cool Zones o Edge and Mesh o Set up for Air - Nitrogen Capable o 220v 3 phase 105 amp o 12’ x 5’ Footprint
Used SMT Equipment | Soldering - Reflow
Hello and thank you for your interest in our Heller 1088EXL Reflow Oven. See attached pictures and information Heller Reflow Oven Model Number: 1088EXL Serial Number: 0201DA1A1-53956 Year: Feb 2001 Left to Right Process Flow 8 heating zone for
Industry News | 2013-01-04 16:00:38.0
04 Jan 2013 Heller Industries will showcase the Mark5 Series - SMT Reflow Soldering Ovens February 19-21 in San Diego, CA USA at the IPC APEX EXPO.
Industry News | 2012-05-11 20:35:45.0
Heller Industries has been awarded a 2012 SMT VISION Award in the category of Soldering Reflow for its 1936 Mark 5 Reflow Oven. The award was presented on April 25, 2012 at the Nepcon China Exhibition.
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Parts & Supplies | Pick and Place/Feeders
ASSEMBLEON - AX ETX Board with heat sink 512M.9498 396 03996 We also supply following Assembleon Spare parts : 9498 396 02118 Pneumatic controller 9498 396 02297 Valve 9498 396 02879 Y motor robot 9498 396 03217 Temp sensor Y movement 94
Parts & Supplies | Pick and Place/Feeders
5322 290 60799 AIR SUPPLY COUPLING 265.89 Service Parts - New 5322 290 60838 SET-UP AUX CONTACT 340.96 Service Parts - New 5322 290 81508 CONTACT ELEMENT 105.27 Service Parts - New 5322 310 10689 FILTER, B
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
Technical Library | 2018-04-27 13:23:31.0
When performing BGA component rework, it is important to know the actual heat that is coming out of the top and bottom heaters. This will be critical in setting up accurate heat profiles. Monitoring your heat output will also keep you aware of your heaters performance so that you will know when the heaters need to be replaced.
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | | | PCB Inspection Courses
The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.
Events Calendar | Wed May 31 00:00:00 EDT 2023 - Wed May 31 00:00:00 EDT 2023 | ,
Chapter Webinar Series: Solving Real-Life Problems Using the Tools of Lean Six Sigma (Part 1 of 3)
Events Calendar | Wed Jun 07 00:00:00 EDT 2023 - Wed Jun 07 00:00:00 EDT 2023 | ,
Chapter Webinar Series: Solving Real-Life Problems Using the Tools of Lean Six Sigma (Part 2 of 3)
Career Center | Florham Park, New Jersey USA | Engineering
Field Service Engineer Job Description The basic function of this position: Installation, training, repair, and implementation of retrofits on the complete line of Heller reflow ovens. Candidate must be a US citizen. DUTIES AND RESPONSIBILITIES: S
Career Center | North Attleboro, Massachusetts USA | Production
SMT Programmer/Operator 1st Shift 1.) Programming set-up and operation of SMT equipment for production. 2.) Troubleshooting and maintaining of feeders. 3.) Proficient in the soldering and de-soldering of surface mount and through hold componen
Career Center | brampton, Ontario Canada | Engineering,Management,Production,Technical Support
- More than 14 years of experience in set-up, calibrate, program, troubleshoot SMT machines and SMT process, for the manufacturing of PCB Electronic Assemblies - 5 year experience in leading position for electronic manufacturing/Process Engineering.
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/problem-with-accuracy-in-allegro_topic1724_post7050.html
Problem with Accuracy in Allegro - PCB Libraries Forum Forum Home > PCB Footprint Expert > Questions & Answers New Posts FAQ Search Events Register Login Problem with Accuracy in Allegro
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Thermaltronics TMT-2000S is based on Curie Heat Technology Toggle menu Call Us! 469-200-1289 Login or Sign Up 0 Search × Search × Main Menu Shipping
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