Industry Directory | Manufacturer
Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.
Industry Directory | Equipment Dealer / Broker / Auctions
WINTECH provides new/used/pre-owned SMT, AI & PCB Assembly (PCBA) equipment of various brands. Also supply service, modification & original or local-made spare parts. We are also an appointed agent for well-known brands.
Heller 1913 MK7 SMT Reflow Oven Heating Zones: Top 13 / Bottom 13PCB Width:50 - 560 mmCool Zones: 3 Toplength: 590cmProduct description: Heller 1913 MK7 SMT Reflow Oven, Heating Zones: Top 13 / Bottom 13, PCB Width:50 - 560 mm, Cool Zones: 3 Top, le
适用于大尺寸PCB板及双轨道生产的世界一流的SMT 回流焊炉 随着最新的技术突破，HELLER推出了全新的MARK 5回流焊系列，为客户提供了更为经济的方案。新型的加热和冷却技术能最大限度 地减少氮气和电力消耗，省氮省电高达40%。因此，MK5系列不仅性能卓越，更是业界最具经济价值的回流焊系列产品。 选择适合您制程需求的回流焊设备 1826MK5 回流焊炉 - 这些马力为高容量要求提供了稳定的性能，同时大大减少预防性保养的时间及空间占地。 1936MK5/2043MK5 回流焊炉 -
Electronics Forum | Wed Apr 27 11:13:41 EDT 2011 | jhinckley
I have a 1800w that the main contactor will not pull in. When i push the contactor in manualy the power goes through but nothing turns on, when i push in the fan contactors all fans come on. The programs seem to load butnothing happens and the sp and
Electronics Forum | Fri Mar 24 15:39:43 EDT 2023 | proceng1
We have a HELLER 1700 running at 208v on an 80A breaker. I doubt that helps much.
Used SMT Equipment | Soldering - Reflow
Hours – 35941Condition – all features work, recently replaced multiple heaters and fans with new factory parts.Flow – left to rightPower requirements – 480V 100AEdge rail, adjustable rail with chain conveyorMesh belt
Used SMT Equipment | THT Equipment
Universal VCD 5 PTH VCD-Sequencer 5 System Power: 220VAC; 6.25A; 1 Phase Air: 90 PSI Machine Dimensions: 72" x 61" x 63" Includes: 80 Station Sequencer Machine Dimensions: 185" x 36" x 77" Feature
Industry News | 2016-06-22 15:33:28.0
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2016 Global Frost & Sullivan Award for Growth Excellence Leadership. Heller Industries has made remarkable improvements to its product and technology portfolios over the last 10 years to emerge a top participant in the SMT reflow soldering equipment market.
Industry News | 2016-05-10 14:16:16.0
GPD Global offers individual pumps for integration into your existing platform – the Jetting NCM5000 Pump is one of them. The Jetting NCM5000 Pump simplifies jetting to its basic elements: hammer, pin, and nozzle. Only the pin and nozzle are wetted parts. This means easy set-up, cleaning, and upkeep.
Parts & Supplies | Assembly Accessories
Product Name: P2148; 1005070MPMZ axis BRAKE Part Number: P2148; 1005070 Description: P2148; 1005070 MPM Z axis BRAKE; POWER OFF brake Applicable models: UP; AP Printing Presses P2148; 1005070 MPM Z axis BRAKE; POWER OFF brake Solenoid val
Parts & Supplies | SMT Equipment
MPM Z axis BRAKE(P2148) Product Name: P2148; 1005070MPMZ axis BRAKE Part Number: P2148; 1005070 Description: P2148; 1005070 MPM Z axis BRAKE; POWER OFF brake Applicable models: UP; AP Printing Presses P2148; 1005070 MPM Z axis BRAKE; POWER OF
Technical Library | 2019-07-10 23:36:14.0
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
Make: Heller Model: 1809 EXL Vintage: 09-2007 Details: (9) Top & Bottom Heating Zones (2) Cooling Zones Windows 7 Operating System Edge Rail Conveyor & Center Board Support Air S
Training Courses | ONLINE | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Events Calendar | Thu Jul 19 00:00:00 EDT 2018 - Thu Jul 19 00:00:00 EDT 2018 | ,
Physics of Failure in the Aircraft Development Process
Events Calendar | Tue Apr 25 07:00:00 EDT 2017 - Tue Apr 25 16:30:00 EDT 2017 | Rosemont, Illinois USA
Employment Law Forum 2017
Manufacturers Alliance for Productivity and Innovation (MAPI)
Career Center | Florham Park, New Jersey USA | Engineering
Field Service Engineer Job Description The basic function of this position: Installation, training, repair, and implementation of retrofits on the complete line of Heller reflow ovens. Candidate must be a US citizen. DUTIES AND RESPONSIBILITIES: S
Career Center | Santa Clara, California USA | Engineering
Job Description: � Manage and perform preventative maintenance activities of equipment � Tooling order and management for production � Maintain efficient record keeping of PM records and calibration � Able to perform new equipment buy-off, set up
Career Center | garaden grove, California USA | Engineering,Management,Production,Quality Control,Technical Support
11 years experience in SMT process.
Career Center | , Israel | Engineering,Maintenance,Technical Support
I was born on June , 1972 in Khmelnitsky city , Ukraine . I am male. From 1979 to 1987 I was studying at secondary school #7, having finished which I entered the Technical College of Khmelnitsky in specialty Machine Tools with Computer Numeric Contr
Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.
4 Vreeland Rd.
Florham Park, NJ USA
Phone: 973-377-6800
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