Industry Directory | Manufacturer
Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.
Industry Directory | Consultant / Service Provider / Distributor / Equipment Dealer / Broker / Auctions / Manufacturer / Manufacturer's Representative
DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD is a company which mainly provide used and new SMT parts, provide repair SMT key parts service,new/used SMT machine trading,SMT consumables and Peripherals equipment,Clean room, ESD..
The World's Best Convection Reflow Oven The ultimate high volume production reflow oven with belt speeds up to 1.4 m/min to accommodate the fastest pick and place systems. Lead Free Certified reflow oven! Maintenance Free! Lowest Nitrogen &
The World's Best SMT Convection Reflow Ovens for Large Boards and Dual Lane 1826 Mark 5 reflow oven provides consistent performance for high volume reflow requirements while minimizing preventative maintenance and floorspace. Lead Free Certified!
Electronics Forum | Mon Oct 14 00:05:50 EDT 2013 | felo188
Some ideas?
Electronics Forum | Tue Oct 01 14:53:24 EDT 2013 | felo188
it's means that a pcb part responsible for second top zone is broken. To make sure i changed second thermocouple and heater with first. Now there is no overshoot. But I have still problem with automatically shutdown. It is turning off after 1 or 2
Used SMT Equipment | Soldering - Reflow
8 Heat Zones Voltage: 480V Max PCB size: 18" Feed Direction: L-R Additional Options: EHC
Used SMT Equipment | Soldering - Reflow
8 Heat Zones Voltage: 480V Max PCB size: 18" Feed Direction: L-R Additional Options: EHC, Fan Speed Control
Industry News | 2012-05-11 20:35:45.0
Heller Industries has been awarded a 2012 SMT VISION Award in the category of Soldering Reflow for its 1936 Mark 5 Reflow Oven. The award was presented on April 25, 2012 at the Nepcon China Exhibition.
Industry News | 2018-07-02 07:23:51.0
Heller Industries Announces That It Will NOT Be Subject To The 25% Import Duty on Reflow Oven Purchases
Parts & Supplies | SMT Equipment
XMP card of KE2050 Professional maintenance JUKI SMT various circuit boards: JUKI CPU motherboard, SUB-CPU board, laser control board, servo drive card, X / Y / Z / Q-axis drive, 24V power supply card, head boards, image control card, I / O board
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Parts & Supplies | Pick and Place/Feeders
HELLER - SPARE PARTS HC1 TEMPRERATURE CONTROLLER .HC1 Rotary Encoder Heller ..E40H12-200-6-L-B Motor for Heller oven ..86YSY80-2 HEATER OF HELLER ..HEATER OF HELLER Reflow Heller Heater ..HL-255 Heller Motor JF1F071N Encoder
Technical Library | 2019-07-10 23:36:14.0
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
Nano-copper sintering in formic acid vapor.
Career Center | Florham Park, New Jersey USA | Engineering
Field Service Engineer Job Description The basic function of this position: Installation, training, repair, and implementation of retrofits on the complete line of Heller reflow ovens. Candidate must be a US citizen. DUTIES AND RESPONSIBILITIES: S
Career Center | San Diego, California USA | Engineering,Production,Technical Support
Looking for experienced SMT Equipment Technicians. Must be familar with DEK, MPM, Juki, Siemens and Heller Reflow Oven technology. Ideal candidiate should have AS technology degree or equiv training and 3-5 years experience in relevent SMT assembly.
Career Center | , Israel | Engineering,Maintenance,Technical Support
I was born on June , 1972 in Khmelnitsky city , Ukraine . I am male. From 1979 to 1987 I was studying at secondary school #7, having finished which I entered the Technical College of Khmelnitsky in specialty Machine Tools with Computer Numeric Contr
Career Center | Lapu-lapu, Cebu Philippines | Engineering,Maintenance,Production
Sept. 2, 2009 to Present, TPM2, LEAR Corporation, MEPZ-1, Lapu-Lapu City • Provides SMT engineering support to day-to-day manufacturing operations. • Handles SMT pick-and-place machine (Fuji, CP7, CP6 and QP242 Series, Universal Genesis GI-14D). •
1st Place Machinery Inc. | http://www.firstplacemachinery.com/firstplace_heller932c_benchtop_reflow_oven.html
Heller Reflow Oven Heller Industries Benchtop IR Reflow Oven Serial Number: 089123 Model Number: 932C-H 3 Programmable top and bottom heating zones 12 inch Wide Mesh Belt Rapid Heat up Tim 480 Volt - 50 Amps - 60HZ Machine is missing the computer. Price
| http://etasmt.com:9060/te_product_g/2020-08-06/15629.chtml
Heller Reflow Oven M odel A600 A600D A800 A800D Dimension (L*W*H)mm 3400x800x1350 4150x850x1350 Weight Approx.739KG Approx.850KG Number Of Heating Zones Top6/Bottom6 Top8/Bottom8 Length Of Heating Zones 2300mm 2600mm Power For Warm Up 12kw 15kw Power Consumption 5kw 6kw Transmission Agent Mesh Mesh+Rail Mesh Mesh
Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.
4 Vreeland Rd.
Florham Park, NJ USA
Phone: 973-377-6800
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