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. If the cohesive force among metal powders in solder paste is smaller than the force created by the gasification, a small amount of solder paste will leave the soldering pad and some of them may hide under the chip components. When reflow soldering
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> Silkscreen Line Width: The Silkscreen Line Widths were not applying the assigned Density Level line width Options > Components > BGA If the “Add Fiducials if Pin Pitch