Electronics Forum: high-performance gold plating for microdevices (1)

Gold surface contam after prebake 150C for 3 hrs

Electronics Forum | Wed Apr 07 22:15:31 EDT 2004 | davef

We're not familiar with the AUG5 from Taiyo. [It doesn't show on their US site.] Is it liquid photoimageable? Printed solder masks are more likely to bleed. But you wouldn't have any solderability with bleed. Your plating seems acceptable [if th

Industry News: high-performance gold plating for microdevices (2)

Elastomer Socket for Infineon's BGA221

Industry News | 2011-03-11 14:47:03.0

Ironwood Electronics has recently introduced a new high performance BGA socket for 0.4mm pitch 221 ball BGA - SG-BGA7162. The socket operates at bandwidths up to 10 GHz with less than 1dB of insertion loss.

Ironwood Electronics

GHz Bandwidth Socket for Dual WLCSP

Industry News | 2011-02-26 14:35:16.0

Ironwood Electronics has recently introduced a new high performance WLCSP socket for 0.5mm pitch 40 ball WLCSP and 0.4mm pitch 30 ball WLCSP accommodated in the same socket.

Ironwood Electronics

Express Newsletter: high-performance gold plating for microdevices (292)

SMTnet Express - August 7, 2014

SMTnet Express, August 7, 2014, Subscribers: 23058, Members: Companies: 13975, Users: 36604 Gold Embrittlement In Lead-Free Solder. Craig Hillman, Nathan Blattau, Joelle Arnold, Thomas Johnston, Stephanie Gulbrandsen; DfR Solutions , Julie Silk

Partner Websites: high-performance gold plating for microdevices (324)

Material Choices for High-Speed Flexible Circuits | Imagineering, Inc.

Imagineering, Inc. | https://www.pcbnet.com/blog/material-choices-for-high-speed-flexible-circuits/

. Flexible circuits are handy, but the most significant problem they present is poor performance in high-speed applications. For this reason, PCB designs that incorporate this type of technology sometimes have to be creative in the application of flexible circuits

Imagineering, Inc.


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