Electronics Forum | Wed Mar 26 12:15:11 EDT 2008 | patrickbruneel
Hi all, I wanted to share this with y�all, because it�s informative on what is to come but at the same time hilarious. ******************************************************** From Dr. Craig Hillman (DfR Solutions) RoHS 2 Moves Forward (Run For Yo
Electronics Forum | Tue Mar 07 10:46:24 EST 2006 | muse95
I have to disagree with you, BillyD. If Craig searches the forum, he will see that the concept of a Pbfree BGA with SnPb paste has been debated many times. You say it is fine. I say it is NOT. There have been several studies done that clearly sho
Industry News | 2008-03-05 22:46:03.0
This 90 minute webcast will feature noted speakers Dr. Craig Hillman, DfR Solutions, and Mumtaz Bora, Kyocera Wireless Corporation. Dr. Hillman will review the prospect of in-house testing.
Industry News | 2018-04-18 18:06:14.0
SMTA Europe announces Session 6 Technical Program on Automotive Electronics at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.
Technical Library | 2015-07-09 17:44:11.0
50,000) number of short duration (
Technical Library | 2009-10-14 21:17:47.0
Electrochemical migration (ECM) is defined as the growth of conductive metal filaments across a printed circuit board (PCB) in the presence of an electrolytic solution and a DC voltage bias. ECM, also known as dendritic growth, is a critical issue in the electronics industry because the intermittent failure behavior of ECM is a likely root-cause of the high occurrence of field failures identified as no trouble found (NTF)/could not duplicate (CND)
SMTnet Express, August 7, 2014, Subscribers: 23058, Members: Companies: 13975, Users: 36604 Gold Embrittlement In Lead-Free Solder. Craig Hillman, Nathan Blattau, Joelle Arnold, Thomas Johnston, Stephanie Gulbrandsen; DfR Solutions , Julie Silk
SMTnet Express, July 9, 2015, Subscribers: 23,004, Members: Companies: 14,461 , Users: 38,507 Predicting Fatigue of Solder Joints Subjected to High Number of Power Cycles Craig Hillman, Nathan Blattau; DfR Solutions , Matt Lacy; Advanced Energy
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
]. That position is supported by results from several studies in which macrovoids did not reduce board level reliability [11-13]. Independent investigations by Sethuraman [14], Coyle [15], and Hillman [16
