Industry Directory | Manufacturer
ESD manufacturer for baeklite sheets, 3025 Phenolic Cotton Sheet, 3240/FR4 Epoxy sheets, alternative Durostone Sheet CAS761, Risho similar solder pallet material, PCB solder pallet holddowns
Nordson Dage XD7600NT500 X-Ray Inspection System with X-Plane Analysis - Datest was one of the first users of the X-Plane algorithm. We now have 3 years of experience using X-Plane. It is a very powerful tool for detecting head-in-pillow (HiP) de
Open permanent magnet free maintenance 0.25 Tesla field Integrated small surface, system can be installed in a single enclosure 18 m² Low power consumption: less than 3 kW of power output normal 220 / 110V Ergonomic rotating patient table with a
Electronics Forum | Sun Jun 14 13:16:10 EDT 2020 | davef
Where are HIP connections located?
Electronics Forum | Fri Jun 12 05:56:53 EDT 2020 | sssamw
I cannot see the logic connection between HIP and RSS or RTS, or between HIP and solder paste volume because volume is ok. Did you measured the BGA solder profile?
Used SMT Equipment | Pick and Place/Feeders
hip theoretical speed of 21,000CPH Mounting range 0402mm Chip to 55mm Placement accuracy plus or minus 0.03mm PCB size 460 * 400 * 4.2 ~ 50 * 40 * 0.38 Equipment size L1,650 * D1,680 * H1,530 Power 4.7KVA Equipment weight 1800kg Samsung SMT
Used SMT Equipment | General Purpose Equipment
MODEL : T222 SPECIFICATION : Thermoplactic Material : Pvc ,PP,PS,HIPS,APET,PETG,EVA Materia
Industry News | 2011-08-17 12:59:10.0
The SMTA announced that SMTA International will provide updated research on Head-in-Pillow component soldering defects as well as a focused tutorial on the subject. SMTAI will take place October 16-20, 2011 in Ft. Worth, Texas.
Industry News | 2012-06-01 09:09:55.0
Head-in-Pillow (HiP) soldering defects are common with modern SMT component placement. As a result, Practical Components has introduced the PBGA 928-HiP, a component that is designed specifically to be susceptible to HiP defects. It features a large 4x4 body size, 928 balls and a single small die that has a propensity toward the ball-in-socket HiP soldering defect.
Parts & Supplies | Other Equipment
C20-CPU84-E C200H-CPU01 C2000HCPU01E2V C2000HCPU0IE2V1 C200H-CPU02 C200H-CPU03 C200h-CPU11 C200H-CPU21 C200HCPU3E2 C200H-CPU31 C200HCPU31E2 C200HS-CPU01 C200HS-CPU21 C200HS-CPU31 C200HE-CPU11 C200HE-CPU32 C200HE-CPU42 C200HG-CPU33 C200HG-CP
Technical Library | 2017-07-06 15:50:17.0
Head-in-pillow (HiP) is a BGA defect which happens when solder balls and paste can't contact well during reflow soldering. Package warpage was one of the major reasons for HiP formation. In this paper, package warpage was measured and simulated. It was found that the package warpage was sensitive to the thickness of inside chips. A FEM method considering viscoelastic property of mold compound was introduced to simulate package warpage. The CTE mismatch was found contributes to more than 90% of the package warpage value when reflowing at the peak temperature. A method was introduced to measure the warpage threshold, which is the smallest warpage value that may lead to HiP. The results in different atmospheres showed that the warpage threshold was 50μm larger in N2 than that in air, suggesting that under N2 atmosphere the process window for HiP defects was larger than that under air, which agreed with the experiments.
Technical Library | 2015-11-25 14:15:12.0
In this study various printed circuit board surface finishes were evaluated, including: organic solderability preservative (OSP), plasma finish (PF), immersion silver (IAg), electroless nickel / immersion silver (ENIS), electroless nickel / immersion gold hi-phosphorus (ENIG Hi-P), and electroless nickel / electroless palladium / immersion gold (ENEPIG). To verify the performance of PF as a post-treatment option, it was added to IAg, ENIG Hi-P, and ENEPIG to compare with non-treated. A total of nine groups of PCB were evaluated. Each group contains 30 boards, with the exception on ENIS where only 8 boards were available.
LED Pick and Place Machine If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. smt machine,LED Pick and Place Machine,LED Pick and Place,led pic
The X2 is an advanced In-line X-RAY inspection system designed for high-speed automatic inspection in production lines. Transmission X-RAY technology is combined with patented Slice-Filter-Technology (SFT) for double-sided PCB assembly and component
Events Calendar | Fri Oct 06 00:00:00 EDT 2023 - Fri Oct 06 00:00:00 EDT 2023 | Monterrey, Mexico
Mexico Technology Day 2023 - ViTrox's Tech Insights & Product Demo
Career Center | Suwanee, Georgia USA | Engineering
Manufacturing Engineer - SMT WE'RE GOING PLACES. FAST. You probably haven't heard of us--we're Solectron�and chances are we built the PC in your office, its motherboard, the pager that is on your hip, the server that runs the network and the cellu
Career Center | Senai, Johor Malaysia | Engineering,Production,Quality Control
A Six Sigma Green Belt practitioner with high experience in process,quality and production engineering.
Career Center | ORLANDO, Florida USA | Engineering,Maintenance,Production,Technical Support
Manufacturing tech/eng for a contract manufacture for 10+ years. Been working in the SMT industry for a total of 20yrs. Have done everything from operator to process work. Most familiar with Assembleon, MPM, DEK, BTU,Electrovert, SLIM-KIC, SUPER-MOLE
SMTnet Express, May 26, 2016, Subscribers: 24,776, Companies: 14,803, Users: 40,361 Influence of Salt Residues on BGA Head on Pillow (Hip) J. Servin, P. Gomez, M. Dominguez, A. Aragon; Continental Corporation The oxide layers are known as wetting
