Industry Directory | Manufacturer
UWELLPCB.com is the PCB supplier. We offer PCB from single side board, double side PCB to 32layer board,including the Rigid PCB, Flex PCB, Rigid-flex PCB,Quick-turn prototype and PCB assembly
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Smt I-pulse K01 nozzle used in pick and place machine Smt I-pulse K01 nozzle used in pick and place machine I-pulse series nozzles: 1.M1/M4 type:M001/M002/M003/M004/M005/M006/M012/M013/M017/M018/M019/M020/M021/M022/M031/M032/M033 2.M2 type:N001/N00
New Equipment | Education/Training
This two day course is based on the IPC-7721. Students will learn how to repair surface mount pads, BGA pads, finger contacts, traces, laminate, plated through holes and more. Students will be introduced to the proper techniques for SMT & PTH compon
Electronics Forum | Tue Jul 06 15:06:35 EDT 1999 | Mike Demos
Is anyone aware of some guidelines regarding through-hole in SMT pads? One of our designers wants to add through-hole leads in some SMT pads for an inductor. The size of the hole is 0.032 inches and takes-up approximately 25% of the pad area. This
Electronics Forum | Wed Jul 07 14:14:03 EDT 1999 | Dave F
| Is anyone aware of some guidelines regarding through-hole in SMT pads? One of our designers wants to add through-hole leads in some SMT pads for an inductor. The size of the hole is 0.032 inches and takes-up approximately 25% of the pad area. Th
Used SMT Equipment | Pick and Place/Feeders
Automatic pick and place machine TP400V is the high cost-effective equipment in the market, it can pick and place variety of components by its vacuum nozzle. The machine can mount 0603、 SOIC、PLCC、QFP IC and many SMD chip components; optional vision
Used SMT Equipment | Pick and Place/Feeders
Automatic pick and place machine 210 is the high cost-effective equipment in the market, it can pick and place variety of components by its vacuum nozzle. The machine can mount 0402、 SOIC、PLCC、QFP IC and many SMD chip components; optional vision pos
Industry News | 2016-06-27 14:59:09.0
GPD Global introduces the NEW TempView Thermal Imaging System that ensures the success of heated dispensing processes like Underfill, Encapsulations, Dam and Fill, and more. The TempView Thermal Imaging System monitors the temperature of the entire substrate for complete heat profile characterization. Regions of the product may be selected for monitoring during the heating process. Now you can accurately monitor temperature of specific devices to be sure they are up to temperature before starting a process.
Industry News | 2017-04-11 21:19:32.0
GPD Global offers versatile large format inline dispensing systems and stand-alone liquid dispense technologies for maximizing product yield. This is the largest standard PCB dispensing system platform in the industry.
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Parts & Supplies | SMT Equipment
Panasonic smt nozzles models: Panasonic MSR SMT NOZZLE Part Number Description 10468S0002 MSR - SMT NOZZLE - VVS (0.84 X 0.60) 10468S0003 - NZ. - VS (1.0 X 0.64) 10468S0004 -NZ. - S (1.6 X 1.06) 1046710134 -NZ. - M (1.60mm) 10467S0001 -NZ. - L
Parts & Supplies | SMT Equipment
Panasonic smt nozzles models: Panasonic MSR SMT NOZZLE Part Number Description 10468S0002 MSR - SMT NOZZLE - VVS (0.84 X 0.60) 10468S0003 - NZ. - VS (1.0 X 0.64) 10468S0004 -NZ. - S (1.6 X 1.06) 1046710134 -NZ. - M (1.60mm) 10467S0001 -NZ. - L
Technical Library | 2023-06-12 18:52:18.0
This paper will review stencil design requirements for printing solder paste around and in through-hole pads / openings. There is much interest in this procedure since full implementation allows the placement of both through-hole components as well as SMD's and the subsequent reflow of both simultaneously. This in turn eliminates the need to wave solder or hand solder through-hole components.
Technical Library | 2019-10-10 00:26:28.0
Voids are a plague to our electronics and must be eliminated! Over the last few years we have studied voiding in solder joints and published three technical papers on methods to "Fill the Void." This paper is part four of this series. The focus of this work is to mitigate voids for via in pad circuit board designs. Via holes in Quad Flat No-Lead (QFN) thermal pads create voiding issues. Gasses can come out of via holes and rise into the solder joint creating voids. Solder can also flow down into the via holes creating gaps in the solder joint. One method of preventing this is via plugging. Via holes can be plugged, capped, or left open. These via plugging options were compared and contrasted to each other with respect to voiding. Another method of minimizing voiding is through solder paste stencil design. Solder paste can be printed around the via holes with gas escape routes. This prevents gasses from via holes from being trapped in the solder joint. Several stencil designs were tested and voiding performance compared and contrasted. In many cases voiding will be reduced only if a combination of mitigation strategies are used. Recommendations for combinations of via hole plugging and stencil design are given. The aim of this paper is to help the reader to "Fill the Void."
The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo
This video is on the dry film pad repair technique per IPC 7721 standards. BEST professional instructors demonstrate the proper technique for the repair for PCB pads using the dry film. http://www.solder.net More on PCB pad repair here: http://www.s
Training Courses | | | IPC-7711/7721 Specialist (CIS) Recert.
The Certified IPC-7711/7721 Specialist (CIS) recertification courses are intended for those individuals who were previously certified as IPC-7711/7721 Specialist.
Training Courses | | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.
Events Calendar | Wed Dec 06 00:00:00 EST 2017 - Wed Dec 13 00:00:00 EST 2017 | Rolling Meadows, Illinois USA
X-Ray of PCBs Webtorial
Events Calendar | Tue Jan 23 00:00:00 EST 2018 - Tue Jan 23 00:00:00 EST 2018 | New Milford, Connecticut USA
FREE Webinar: Eliminate Circuit Board Problems and Failure Modes
Career Center | Bangalore, India | Engineering,Maintenance,Production,Technical Support
SMT Stencil designing & Knowledge of full SMT process software known CAD/CAM -circuit CAM Pro 7.3,GC Power station, GCCAM Edit,Auto CAD, Fault finding of Electronic Boards & Servicing electronic machines.
SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Stencil Design for Mixed Technology Through-hole / SMT Placement and Reflow by William E. Coleman, Photo
| https://pcbasupplies.com/ezload-replacment-pads/
ezLOAD Replacment Pads Login Create Account Contact View My Cart Menu × Categories Hand Soldering & Rework Automation Tooling PCB Support Systems Soldering Robots Material Handling Dry Storage Cabinets Component Handling Selective Solder Nozzles Pick
| https://www.eptac.com/webinars/where-do-blow-holes-in-solder-joints-come-from/
Where do Blow Holes in Solder Joints Come From? - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
