SMT Express, Volume VI, Issue No. 2 - from SMTnet.com The Answers are at NEPCON East / Electro EXHIBITION: MAY 5-6, 2004CONFERENCE: MAY 4-6, 2004The Hynes Convention Center - Boston, MA Register Now For FREE Show Admission NEPCON East
How to Profile a PCB News Forums SMT Equipment Company Directory Calendar Career Center Advertising About FREE Company Listing! How to Profile a PCB Especially with the new lead free solders, getting the correct temperature
| http://etasmt.com:9060/te_news_industry/2021-08-31/23964.chtml
(from room temperature to 150°C) Solder paste collapse -- ramp up too fast The solvent in flux cannot vapour thoroughly, so the viscosity of the solder paste will be decreased and cause the paste collapse Soldering ball -- ramp up
| https://www.eptac.com/blog/are-voids-in-solder-joints-really-an-issue
. Kind of interesting how that problem was solved, or was it solved and we just adapted our acceptable condition and moved on? We still get questions as to the solder ball condition, but it is mostly an educational issue, or new people wanting to reinvent the wheel
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