SMTnet Express July 25, 2013, Subscribers: 34972, Members: Companies: 13435, Users: 34972 Using Automated 3D X-Ray Inspection to Detect BTC Defects by Barbara Koczera; Test Research USA , An Qi Zhao; Flextronics Detecting marginal joints and other
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
]. His analysis, summarized in Figure 1, shows that there are multiple types of voids and multiple void formation mechanisms. Voids can be differentiated with respect to how they are formed, where they reside in the solder joint and how they affect the reliability of the solder joint
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