Electronics Forum | Wed Dec 19 02:24:40 EST 2001 | ianchan
Did I mention, we tried to use the same WS flux formulae to brush-cover the affected flex-PCB pads, and subject it to another round of water-wash, followed by oven-baking, and it still doesn't help abit? Oven bake : 100 deg-C, approx 15~30mins (manu
Electronics Forum | Mon May 13 23:44:26 EDT 2019 | dami0629
if use tray cannot solve the problem, you can change from the design 1)Reduce the effect of temperature on PCB 2) PCB USE HIGH TG 3) BOARD THICKNESS TOO THIN 4) MODIFY THE BOARD SIZE 5) Reduce the V-CUT depth.
Industry News | 2021-02-12 16:57:01.0
New and experienced managers will gather at the Managers Forum at IPC APEX EXPO on March 8 to discuss strategies for thriving during times of crisis.
Industry News | 2012-05-15 10:31:04.0
IPC Midwest will highlight the new technologies, materials and processes in electronics manufacturing to help engineers solve their challenges and work smarter.
Parts & Supplies | Pick and Place/Feeders
How to do JUKI shaped component image? 1: Master the type of the opposite sex component 2: Master pin or ball pitch, pin width, length and ball diameter 3: Recognition method: transmission, side, reflection 4: VCS TEST can be 5: For the
Bob Willis "How to Do It" video clip explains how to test BGA or Area Array Packages for solderability. The reason this is difficult to do by other means is the solder terminations would be displaced during solder contact. A simple test like this als
Events Calendar | Wed Jun 20 00:00:00 EDT 2018 - Wed Jun 20 00:00:00 EDT 2018 | ,
Everything You Need to Know About X-Rays