Industry Directory | Consultant / Service Provider / Manufacturer
US manufacturer of microelectronic surface mount components including chip resistors, chip attenuators, RF terminations, dividers, splitters, couplers, low pass filters and thermal management devices.
Specialists in end-of-life preservation packaging of electronics. Shelf-life consultants. Marketing, sales and distribution of Static Intercept and Corrosion Intercept Reative Polymers. Eliminating rust, tarnish and corrosion in metals-chemical free
RCX Series Resistors Versatile Wrap-Around Chip With resistance values from 1ohm to 1Teraohm, RCX Series resistors are ideal for a wide variety of applications. Wraparound terminations are perfect for epoxy or solder attachmen
Electronics Forum | Sun Sep 01 05:39:36 EDT 2013 | leardkattiya
Hi, can someone give definition on pot life? does the pot life start once it's been taken out from fridge or the pot life starts once recommended thawing ends?
Electronics Forum | Thu Sep 05 22:33:28 EDT 2013 | davef
It depends: * If you're talking jars, I'd be as conservative as possible. So, 3 days from when the jar is removed from the frig would be my pot life limit. * If you're talking Semco cartridges, I'd be talking about 10 days from when the cartridge is
Industry News | 2018-02-19 13:55:53.0
IPC — Association Connecting Electronics Industries® Pb-free Electronics Risk Management (PERM) Council has developed the first single document dedicated solely to assisting design engineering in the development of electronics that are completely lead-free (Pb-free) and meet the demanding requirements of aerospace, defense and high performance (ADHP) products and systems.
Industry News | 2018-10-18 11:08:03.0
Different Techniques for Plating
Technical Library | 2009-12-03 14:27:29.0
This paper provides additional data in support of shelf life extension for BGA and Die Size BGA (DSBGA) Packages.
Technical Library | 2009-12-03 12:51:58.0
Each year the semiconductor industry routes a significant volume of devices to recycling sites for no reliability or quality rationale beyond the fact that those devices were stored on a warehouse shelf for two years. This study identifies the key risks attributed to extended storage of devices in uncontrolled indoor environments and the risk mitigation required to permit safe shelf-life extension.
The natural sustainable desiccant solution for moisture controlled packaging Desiccants are hygroscopic (moisture-adsorbent) substances that are packaged and used to protect a broad range of products from degradation due to moisture, helping to main
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Events Calendar | Wed Apr 20 00:00:00 EDT 2022 - Wed Apr 20 00:00:00 EDT 2022 | ,
Virtual Course: Selection Criteria of Surface Finish for Next Generation PCB Technologies
Events Calendar | Tue May 15 00:00:00 EDT 2018 - Tue May 15 00:00:00 EDT 2018 | ,
Parts and Assembly Storage Life: How to Determine and Manage
Career Center | Hyderabad, Telangana India | Engineering,Maintenance,Production
Experience in handling Process related issues throughout the Product Manufacturability. Programming and maintenance of SMT Pick and Place Machines of Mirae, Panasonic, NXT and MyData Programming and maintenance of Solder Paste Printer of DEK
Career Center | , California | Quality Control
Tammy T Vo P.O. Box 2213 (714) 254-5073 E-mail: nhutamvo@yahoo.com Position of Interest Senior Quality Inspector Aerospace Manufacturing. / Electronic PCBA/Advanced coating technologies Profile of Qualifications 12 years of experience wo
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/industries/medical-life-science-and-pharmaceutical
. Layer Multiplication Technology (LMT) EDI® Layer Multiplication Technology (LMT) developed for film and sheet promises to extend the shelf life of retort, hot fill, and flexible packaging, while increasing the formability in
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