Electronics Forum: in slightly (36)

Losing parts in reflow

Electronics Forum | Wed Jun 13 16:09:28 EDT 2007 | rgduval

The parts were soldered in place on the first side. Any recommendations on material for this kind of fixture? I've shimmed boards off the belt before with titanium wave plows...but, I'd love to find something slightly more elegant.

Paste in hole question

Electronics Forum | Mon Aug 18 15:18:08 EDT 2008 | realchunks

Open the same size as the via's anular ring. Any slight off print will wet its way back into the via hole.

Industry News: in slightly (29)

Electronics Industry Sentiment Slips in July, the Third Consecutive Month's Decline

Industry News | 2024-07-29 12:36:03.0

IPC releases July 2024 Global Sentiment of the Electronics Supply Chain Report

Association Connecting Electronics Industries (IPC)

Electronics Industry Sentiment Rises in March

Industry News | 2024-04-03 07:15:13.0

IPC releases March 2024 Global Sentiment of the Electronics Supply Chain Report

Association Connecting Electronics Industries (IPC)

Technical Library: in slightly (1)

Review of Interconnect Stress Testing Protocols and Their Effectiveness in Screening Microvias

Technical Library | 2016-11-30 15:53:15.0

The use of microvias in Printed Circuit Boards (PCBs) for military hardware is increasing as technology drives us toward smaller pitches and denser circuitry. Along with the changes in technology, the industry has changed and captive manufacturing lines are few and far between. As PCBs get more complicated, the testing we perform to verify the material was manufactured to our requirements before they are used in an assembly needs to be reviewed to ensure that it is sufficient for the technology and meets industry needs to better screen for long-term reliability. The Interconnect Stress Testing (IST) protocol currently used to identify manufacturing issues in plated through holes, blind, or buried vias are not necessarily sufficient to identify problems with microvias. There is a need to review the current IST protocol to determine if it is adequate for finding bad microvias or if there is a more reliable test that will screen out manufacturing inconsistencies. The objective of this research is to analyze a large population of PCB IST coupons to determine if there is a more effective IST test to find less reliable microvias in electrically passing PCB product and to screen for manufacturing deficiencies. The proposed IST test procedure will be supported with visual inspection of corresponding microvia cross sections and Printed Wiring Assembly (PWA) acceptance test results. The proposed screening will be shown to only slightly affect PCB yield while showing a large benefit to screening before PCBs are used in an assembly.

Raytheon

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4 Common Errors In SMT Assembly - Blackfox

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4 Common Errors In SMT Assembly - Blackfox Skip to content Blackfox Premier Training & Certification +1 (888) 837-9959 Search: Course Calendar Course Calendar 2024 IPC Certification IPC Courses IPC-A-600 IPC 7711/7721 IPC-A-6012 IPC 7711/7721 Recert IPC-A-610 IPC/WHMA-A-620 IPC-A-610 Recert IPC/WHMA-A-620 Recert J-STD-001

Blackfox Training Institute, LLC


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