Industry Directory | Manufacturer
Solder pastes, solder preforms, solder spheres, soldering fluxes, electrically-conductive adhesives. All alloys: tin-lead, lead-free, indium alloys, and more.
Industry Directory | Manufacturer
AIM is a leading global manufacturer of solder assembly materials for the electronics industry.
New Equipment | Solder Materials
Indium Corporation is a developer, manufacturer, and global supplier of: specialty solders (including solder paste, preforms, spheres, columns, wire, tubing, ribbon, and foil), fluxes, electrically-conductive adhesives, inorganic compounds (including
New Equipment | Solder Materials
8 hours in controlled environment) Prints consistently at a wide range of speeds Wide reflow process window for profiling Excellent wetting on a variety of surface finishes Maintains tack over time Suitable for SnPb eutectic alloys as well
Electronics Forum | Wed Apr 14 12:27:49 EDT 2004 | pjc
try Indium Corp's SMQ230. http://ncsmq230.indium.net/ Peak "on board" temps of 229C with good wetting have been obtained.
Electronics Forum | Thu Apr 15 15:54:13 EDT 2004 | pjc
You ned to speak with an apps engineer from a paste supplier that can go through their alloys. I know Indium has such alloys. Any vendor should be able to supply you a list of alloys avbl in NC paste with their liquidous points.
Used SMT Equipment | Soldering - Reflow
This machine is included in an online auction. Please visit the following website for more details on this machine. http://bajabid.hibid.com/catalog/116587/wyndsor-sealed-bid-auction/?tab=0&q=8
Used SMT Equipment | Soldering - Reflow
2022 Essemtec RO300FC Reflow Oven Demo Never Used in Production Reflow Oven The Essemtec RO300FC is a full convection reflow oven designed for the reflow soldering of lead-free solder pastes and the curing of adhesives. Here are some key features
Industry News | 2014-09-15 12:53:40.0
EMS providers Sypris Electronics, MC Assembly, Tetrad Electronics and others will be liquidating some of their excess and unused assets utilizing the online auction services of Baja Bid. The bidding for the auction will open promptly at 8:00am EST on September 15, 2014 and the closing will begin at 1pm EST on September 16, 2014.
Industry News | 2014-09-04 17:00:35.0
EMS providers MC Assembly, Tetrad Electronics, Sypris and others will be liquidating some of their excess and unused assets utilizing the online auction services of Baja Bid. The bidding for the auction will open promptly at 8:00am EST on September 15, 2014 and the closing will begin at 1pm EST on September 16, 2014.
Parts & Supplies | Pick and Place/Feeders
Expert-SAFP (110V/230V configurable) NEW PRICE EUR30.000,-, now for EUR 18.500 net (excl. Tax) only. Perfect for fast and reliable Prototyping. For sale is an Essemtec Expert-SAFP (110V/230V configurable). The Expert-SAFP is a professinal semi-
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
Technical Library | 2023-09-07 14:38:31.0
A repeat customer specializing in high-technology interconnect, sensor, and antenna solutions, partnered with us to dispense small volumes of solder paste (Indium 10.1 SAC305 T6SG 78%m) onto backplane connectors – gold pads 0.175mm x 0.225mm. We performed a test requiring 0.200mm diameter or smaller dots to demonstrate the dispensing capability required.
More Product Information: EN: http://www.essemtec.com/en/products/dispensing/tarantula/ DE: http://www.essemtec.com/produkte/smt-dosieren/tarantula/ Introducing - The Tarantula - State of the art technology, easily integrated in any line. Wide range
Events Calendar | Wed Mar 08 00:00:00 EST 2017 - Wed Mar 08 00:00:00 EST 2017 | San Diego, California USA
San Diego Chapter - Minimizing Voiding in Bottom-Terminating Components
Events Calendar | Wed Oct 20 00:00:00 EDT 2021 - Wed Oct 20 00:00:00 EDT 2021 | ,
Penang Chapter Virtual Vendor & Technical Day
Career Center | karachi, Sind Pakistan | Engineering,Production,Quality Control
For Research and Development Centre: --------------------------------------- -Give Recommendations regarding the functionality & operational security aspects in the ongoing projects by analyzing the detailed operations & functions of the product. -Mo
Career Center | Noida, India | Maintenance,Production
Over 12 years of experience in Assembly Line Production, PCB, SMT, Process Improvements, testing & troubleshooting, time and motion study, Value– Engineering as well as Quality in varied industries.
SMTnet Express, May 14, 2020, Subscribers: 29,151, Companies: 11,003, Users: 25,794 Reliable Selective Soldering For High Volume Assemblies Credits: ITW EAE The number of through hole connections on a circuit assembly are decreasing with the drive
Lewis & Clark | https://www.lewis-clark.com/product-tag/essemtec/
Essemtec Archives - Lewis and Clark, Inc. Skip to content My Cart: $ 0.00 0 View Cart Checkout No products in the cart. Subtotal: $ 0.00 View Cart Checkout Lewis and Clark, Inc
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
Vacuum Reflow Processing On Solder Joint Voiding To be published in the Proceedings of SMTA International, September 17 - 21, 2016, Rosemont, IL
